1SG211HN1F43E2VG

The 1SG211HN1F43E2VG is an Intel Stratix® 10 GX FPGA in a 1760-BBGA (FCBGA) package optimized for high‑performance, bandwidth‑intensive designs. It leverages the Stratix 10 family innovations and Hyperflex core architecture to deliver a large programmable fabric, substantial on‑chip memory, and extensive I/O for demanding networking, compute, and signal‑processing applications.

Key device attributes include 2,110,000 logic elements, 140,509,184 total RAM bits, 688 I/O pins, and a surface‑mount 1760‑FBGA package (42.5 × 42.5 mm). The device is RoHS compliant and specified for an operating temperature range of 0°C to 100°C with a core voltage supply range of 770 mV to 970 mV.

Key Features

• Core Architecture  Built on the Intel Stratix 10 family with Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology as described for the Stratix 10 GX/SX family.
• Logic Capacity  2,110,000 logic elements provided on this device to support large, complex digital designs and implement advanced algorithms on‑chip.
• On‑Chip Memory  140,509,184 total RAM bits for extensive buffering, on‑chip data storage, and large working sets without immediate reliance on external memory.
• I/O and Package  688 I/O pins in a 1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm) FCBGA package with surface‑mount mounting for high‑density board integration.
• Power Supply  Core voltage supply specified from 770 mV to 970 mV to match platform power delivery and sequencing requirements.
• Operating Range and Grade  Extended grade device with an operating temperature range of 0°C to 100°C suitable for systems requiring continuous operation within this range.
• Standards and Compliance  RoHS compliant for reduced hazardous substances in manufacturing and supply chain compliance.

Typical Applications

• Networking and Telecom Infrastructure  High logic density, large on‑chip memory, and extensive I/O make this device suitable for packet processing, switching fabrics, and line cards where bandwidth and buffering are critical.
• Data Center Acceleration  Programmable fabric and large RAM capacity support custom acceleration functions, high‑throughput data paths, and intermediate data staging in server and appliance designs.
• High‑Performance Signal Processing  Large logic element count and substantial on‑chip memory enable complex DSP pipelines and real‑time processing for communications and instrumentation systems.

Unique Advantages

• High Logic Density: 2,110,000 logic elements enable integration of large, multi‑function designs on a single device.
• Massive On‑Chip Memory: 140,509,184 total RAM bits reduce dependence on external memory for buffering and intermediate storage.
• Generous I/O Count: 688 I/Os in a compact 1760‑FBGA package support complex board interfaces and high pin‑count connectivity.
• Family‑Level Performance Innovations: Leverages Stratix 10 family innovations such as the Hyperflex core architecture and 14 nm tri‑gate technology for improved core performance and power characteristics.
• Production‑Ready Packaging: Surface‑mount 1760‑FBGA (42.5 × 42.5 mm) package supports high‑density PCB assembly and reliable thermal/mechanical integration.
• Compliance and Supply‑Chain Fit: RoHS compliance supports environmental and regulatory requirements for commercial designs.

Why Choose 1SG211HN1F43E2VG?

The 1SG211HN1F43E2VG brings a combination of large programmable capacity, substantial on‑chip memory, and a high I/O count in a production‑grade FCBGA package. It is positioned for engineers building bandwidth‑centric, compute‑intensive systems that require a scalable FPGA fabric and the Stratix 10 family innovations.

With clear electrical and thermal parameters—770 mV to 970 mV core voltage and 0°C to 100°C operating range—this device is suited for system designs that need defined supply and temperature envelopes. Its extended grade and RoHS compliance make it appropriate for a wide range of commercial and enterprise applications where verified specifications and manufacturability matter.

Request a quote or submit an inquiry to obtain pricing and availability for 1SG211HN1F43E2VG and to discuss how it fits your next high‑performance FPGA design.