1SG211HN2F43E1VG

The 1SG211HN2F43E1VG is an Intel Stratix® 10 GX FPGA in a 1760-BBGA (1760-FBGA 42.5×42.5) package. It pairs a high-density programmable fabric—2,110,000 logic elements—with large on-chip RAM and a broad I/O count to address high-bandwidth, compute-intensive applications.

Designed for demanding communications, networking, and compute acceleration tasks, this device leverages Stratix 10 family innovations to deliver enhanced core performance and power efficiency while offering a package and thermal window suited to extended-grade deployments.

Key Features

• High-density programmable fabric — 2,110,000 logic elements provide substantial capacity for complex logic, packet processing, and custom compute kernels.
• Large on-chip memory — 140,509,184 total RAM bits for buffering, lookup tables, and on-chip data storage to support high-throughput designs.
• Extensive I/O — 688 user I/O pins to support wide parallel interfaces, multi-lane protocols, and diverse external peripheral connections.
• Advanced core architecture (family) — Stratix 10 family innovations such as the Intel Hyperflex core architecture and 14 nm tri-gate technology are part of the device family feature set referenced in the datasheet.
• High-speed transceiver capability (family) — Stratix 10 GX family includes heterogeneous 3D SiP transceiver tiles with transceiver data rates up to 28.3 Gbps and hard IP for high-speed protocols (family-level features cited in the datasheet).
• Package and mounting — Surface-mount 1760-BBGA (FBGA 42.5×42.5) supplier device package suitable for dense board-level integration.
• Voltage and thermal — Core voltage supply range 770 mV to 970 mV and operating temperature range 0 °C to 100 °C (extended grade).
• Environmental compliance — RoHS compliant.

Typical Applications

• High-performance networking and switches — Use the device's high logic density and large on-chip RAM to implement packet processing, traffic shaping, and multi-protocol switching engines.
• Data center accelerators — Leverage the large logic and memory resources for custom compute offloads, encryption/decryption engines, and data-parallel algorithms.
• Telecommunications and optical transport — Combine the family’s high-speed transceiver capabilities with abundant I/O to implement framer/mapping, FEC, and PHY/PCS functions.
• Test, measurement, and instrumentation — High-density logic and extensive I/O enable real-time signal processing, multi-channel acquisition, and protocol emulation.

Unique Advantages

• Large programmable capacity: 2,110,000 logic elements allow implementation of complex, multi-stage processing pipelines and large-scale state machines on a single device.
• Substantial on-chip memory: 140,509,184 RAM bits reduce reliance on external memory for buffering and accelerate on-chip data paths.
• Broad I/O connectivity: 688 I/Os provide flexibility to interface with high-pin-count peripherals, parallel buses, and multi-lane serial PHYs.
• Extended-grade operation: Rated for 0 °C to 100 °C, supporting deployments that require a wider commercial temperature range.
• Compact, high-density package: 1760-BBGA (42.5×42.5) enables dense PCB layouts while keeping the device footprint manageable for system integration.
• Family-level performance and power characteristics: The Stratix 10 family offers architectural and process improvements cited in the datasheet that drive higher core performance and improved power efficiency for demanding applications.

Why Choose 1SG211HN2F43E1VG?

The 1SG211HN2F43E1VG positions itself for designs requiring substantial programmable logic, on-chip memory, and flexible high-pin-count connectivity within an extended-grade thermal envelope. Its combination of 2,110,000 logic elements, 140,509,184 RAM bits, and 688 I/O makes it suitable for networked, compute-accelerated, and high-throughput systems where integration and on-board performance matter.

Selecting this Stratix 10 GX part offers a path to scalable, high-performance FPGA-based solutions that benefit from the device family’s architectural innovations and high-speed interface capabilities, supporting long-term design scalability and robust system integration.

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