1SG211HN2F43I1VG

The 1SG211HN2F43I1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA (FCBGA) package intended for industrial-grade applications. It pairs a high-density logic fabric with extensive on-chip memory and I/O to address demanding bandwidth and processing requirements.

Built on the Stratix® 10 family innovations, this device leverages the Hyperflex core architecture and high-performance I/O to support high-throughput system functions such as packet processing, signal processing, and compute acceleration while operating across a 770 mV to 970 mV core voltage range.

Key Features

• Logic Fabric 2,110,000 logic elements provide high-density programmable resources for complex logic implementation.
• On-Chip Memory 140,509,184 total RAM bits to store large datasets, buffers, and lookup tables directly on the device.
• I/O and Connectivity 688 user I/O pins enable broad interfacing options for high-channel count designs and high-speed external links.
• Transceiver and Performance Architecture Part of the Stratix® 10 GX family, which integrates the Intel Hyperflex core architecture for increased core performance and supports high-bandwidth transceiver technology as described in the family overview.
• Power and Voltage Operates with a core supply range of 770 mV to 970 mV, enabling compatibility with low-voltage system power domains.
• Package and Mounting 1760-FBGA supplier device package (42.5 mm × 42.5 mm) in a surface-mount 1760-BBGA (FCBGA) format for compact board-level integration.
• Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C to meet extended-temperature deployment requirements.
• Standards and Compliance RoHS compliant to meet common environmental and materials requirements.

Typical Applications

• Networking and Telecommunications High-density logic and abundant I/O support packet processing, backplane interfaces, and line-rate protocol implementations.
• Data Center Acceleration Logic capacity and on-chip memory allow implementation of custom acceleration engines and protocol offloads.
• High-Performance Signal Processing Large internal RAM and dense logic enable real-time DSP, filtering, and algorithmic processing at high throughput.
• Test & Measurement Systems Extensive I/O and configurable fabric suit precision capture, preprocessing, and custom instrumentation logic.

Unique Advantages

• High Logic Density: 2,110,000 logic elements give designers the room to implement complex, multi-function systems on a single device.
• Large On-Chip Memory: 140,509,184 RAM bits minimize external memory dependence and reduce system-level latency for buffering and table storage.
• Extensive I/O Count: 688 I/O pins provide flexible interfacing for multi-channel designs, board aggregation, and high-speed external connectivity.
• Industrial Temperature Range: −40 °C to 100 °C operating range supports deployment in extended-temperature environments and industrial applications.
• Compact, Surface-Mount Package: 1760-FBGA (42.5 mm × 42.5 mm) package enables dense PCB layouts while maintaining robust board-level integration.
• Regulatory Compatibility: RoHS compliance supports designs targeting regulated markets and responsible materials use.

Why Choose 1SG211HN2F43I1VG?

The 1SG211HN2F43I1VG delivers a combination of very large logic capacity, substantial on-chip memory, and high I/O count in an industrial-grade Stratix® 10 GX FPGA package. It is suitable for system designs that require significant programmable resources, deterministic on-chip storage, and broad external interfacing while operating across extended temperature ranges.

For design teams targeting high-throughput networking, compute acceleration, or advanced signal processing, this device offers a scalable, high-density platform backed by the Stratix® 10 family architecture and its performance-oriented features.

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