1SG211HN3F43E1VG

The 1SG211HN3F43E1VG is an Intel Stratix® 10 GX FPGA in a 1760-BBGA (FCBGA) package designed for high-performance, bandwidth‑intensive designs. It combines the Stratix 10 family architecture with a large programmable fabric, abundant on-chip RAM and extensive I/O to address demanding applications in communications, data center acceleration, and advanced signal processing.

Built for extended‑grade operation and surface‑mount assembly, this device targets systems requiring high logic density, significant embedded memory, and flexible system integration while operating within a 0 °C to 100 °C range and a core supply window of 770 mV to 970 mV.

Key Features

• Stratix 10 GX family innovations — Series-level features include the Intel Hyperflex core architecture and Intel 14 nm FinFET technology that enable higher core performance and improved power efficiency compared to previous generations.
• Logic capacity — 2,110,000 logic elements, providing large programmable fabric for complex logic and compute functions.
• On-chip memory — 140,509,184 total RAM bits to support large buffers, caches, and memory-hungry algorithms.
• I/O density — 688 user I/O pins to support wide external interfaces and system connectivity.
• Package and mounting — 1760-BBGA (FCBGA) supplier device package 1760-FBGA (42.5 × 42.5 mm); surface mount for modern PCB assembly flows.
• Power and thermal — Core voltage supply range 770 mV to 970 mV and operating temperature range 0 °C to 100 °C; grade: Extended.
• Series-level high-speed and IP features — Stratix 10 GX/SX family overview documents series capabilities such as high-performance transceivers, hard PCI Express IP, hardened memory controllers and variable precision DSP blocks.
• Regulatory — RoHS compliant.

Typical Applications

• Data Center Acceleration — Large logic capacity and abundant on-chip RAM enable FPGA-based acceleration for network processing, encryption, and custom compute kernels.
• High‑Performance Networking — High I/O count and Stratix 10 family transceiver/IP capabilities (series-level) make the device suitable for packet processing, switch fabric control, and line-rate protocol offload.
• Telecommunications Infrastructure — Use in baseband processing, fronthaul/backhaul interfaces, and FEC implementations where dense logic and memory are required.
• Signal Processing and Test Equipment — Large embedded RAM and millions of logic elements support high-throughput DSP pipelines and real‑time measurement systems.

Unique Advantages

• High programmable capacity: 2,110,000 logic elements provide the headroom for complex algorithms and large-scale custom logic integration.
• Substantial on-chip memory: 140,509,184 RAM bits reduce external memory dependence and improve system latency for buffering and large data sets.
• Extensive I/O: 688 I/O pins facilitate broad peripheral and interconnect options, simplifying board-level integration.
• Family-level advanced IP: Stratix 10 GX series features such as Hyperflex architecture, hard PCIe, and high-speed transceiver capabilities (documented at the series level) accelerate system design and integration.
• Extended-grade operation: Rated for 0 °C to 100 °C operation, suitable for commercial and many industrial environments that require wider temperature tolerance than standard commercial parts.
• RoHS compliant: Conforms to lead‑free and environmentally conscious manufacturing requirements.

Why Choose 1SG211HN3F43E1VG?

The 1SG211HN3F43E1VG delivers a combination of high logic density, substantial embedded memory, and a large I/O complement in a compact 1760‑BBGA package. It is positioned for designers who require a scalable FPGA platform from the Stratix 10 GX family for compute‑ and bandwidth‑intensive applications.

Selecting this device helps consolidate functions into programmable silicon, reduces external component requirements, and leverages Stratix 10 series architectural benefits for long‑term design scalability and integration.

Request a quote or submit an inquiry to evaluate 1SG211HN3F43E1VG for your next high-performance FPGA design project.