1SG211HN2F43I2LG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2110000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 690 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 263750 | Number of Logic Elements/Cells | 2110000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 140509184 |
Overview of 1SG211HN2F43I2LG – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC
The 1SG211HN2F43I2LG is an Intel Stratix® 10 GX FPGA in a 1760-BBGA (FCBGA) package designed for high-density, high-performance digital designs. This device provides 2,110,000 logic elements, extensive on-chip memory and I/O resources, and industrial-grade operating limits for demanding embedded and networking applications.
Built on the Stratix 10 GX family architecture, the device benefits from family-level innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology to support complex logic, memory, and high-speed interface integration.
Key Features
- Logic Capacity Contains 2,110,000 logic elements to implement large-scale programmable logic and complex algorithms.
- On-chip Memory Total RAM of 140,509,184 bits provides abundant embedded memory for buffering, packet processing, and algorithm state storage.
- I/O Density 688 user I/O pins for flexible interfacing to external devices, peripherals, and high-speed transceivers.
- Package & Mounting Delivered in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package with surface-mount mounting for board-level integration.
- Power & Supply Core voltage supply range specified at 820 mV to 880 mV to match system power budgeting and regulator designs.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Regulatory RoHS compliant.
- Family-Level Innovations Stratix 10 GX family-level features include the Intel Hyperflex core architecture, 14 nm tri-gate (FinFET) process, heterogeneous 3D SiP transceiver tiles, high-performance transceivers, hard IP blocks for common protocols, and variable-precision DSP blocks (as described in the Stratix 10 GX device overview).
Typical Applications
- High-Performance Networking Use for packet processing, switching, and high-speed interface aggregation where large logic capacity and abundant I/O are required.
- Data Center Acceleration Suitable for hardware acceleration tasks that need extensive on-chip memory and DSP resources to offload compute from CPUs.
- Telecommunications Equipment Deploy in equipment that demands dense I/O and programmable logic for protocol handling and custom data-plane processing.
- Industrial Systems Fits industrial control and instrumentation applications that require industrial temperature operation and robust, high-density logic integration.
Unique Advantages
- Large Programmable Fabric: 2,110,000 logic elements enable consolidation of multiple subsystems into a single FPGA, reducing board-level complexity.
- Extensive On‑Chip Memory: 140,509,184 bits of RAM support large buffering, packet queues, and stateful processing without immediate reliance on external memory.
- High I/O Count: 688 I/Os provide the flexibility to connect numerous peripherals, SerDes lanes, or parallel interfaces directly to the device.
- Industrial Reliability: Rated for −40 °C to 100 °C operation to meet typical industrial environmental requirements.
- Compact High-Pin Package: 1760-BBGA (42.5 × 42.5 mm) offers a high pin-count solution in a single, board-mountable package for dense system designs.
- Family-Level Performance Innovations: Leverages Stratix 10 GX family features such as the Hyperflex core architecture and 14 nm FinFET process to address high-performance and power-sensitive designs.
Why Choose 1SG211HN2F43I2LG?
The 1SG211HN2F43I2LG positions itself as a high-capacity, industrial-grade FPGA option for engineers needing substantial logic density, large embedded memory, and extensive I/O in a single device. Its specification set is well suited to complex networking, data-center acceleration, telecom, and industrial control designs that require programmable, high-performance logic with robust temperature ratings.
Choosing this Stratix 10 GX FPGA helps consolidate functionality, reduce component count, and leverage the Stratix 10 family innovations for scalable, long-lived designs supported by comprehensive device documentation.
Request a quote or submit an inquiry for pricing, lead time, and availability for the 1SG211HN2F43I2LG Stratix 10 GX FPGA. Our team can assist with technical details and ordering information tailored to your project needs.

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