1SG211HN1F43I2LG

The 1SG211HN1F43I2LG is an Intel Stratix® 10 GX series FPGA device built on the Stratix 10 architecture and Intel Hyperflex™ core innovations. It delivers a high-capacity programmable fabric with large on-chip memory and dense I/O for advanced, high-bandwidth processing applications.

This industrial-grade, surface-mount FPGA targets designs that require significant logic resources, broad I/O connectivity and enterprise-class integration, while benefiting from the Stratix 10 family’s performance and power-efficiency innovations.

Key Features

• Programmable Fabric — 2,110,000 logic elements provide a large, flexible logic resource for complex algorithms and high-density digital designs.
• On-Chip Memory — 140,509,184 total RAM bits for buffering, large lookup tables and memory-intensive processing tasks.
• I/O Density — 688 I/O pins to support wide parallel interfaces, multiple memory channels and extensive peripheral connectivity.
• Core Architecture — Built on the Intel Hyperflex core architecture and Stratix 10 family innovations, delivering improved core performance and architectural enhancements documented for this device family.
• Advanced Process Technology — Stratix 10 family devices leverage Intel 14 nm tri-gate (FinFET) process technology as described in the device overview.
• Package & Mounting — 1760-BBGA (FCBGA) in a supplier device package listed as 1760-FBGA (42.5x42.5) and surface-mount mounting for compact, board-level integration.
• Power — Core supply range specified at 820 mV to 880 mV for the device core domain.
• Operating Range — Industrial temperature rating from -40°C to 100°C for deployment in demanding operating environments.
• Compliance — RoHS compliant.

Typical Applications

• High-performance Networking — Use the device’s large logic capacity and high I/O count for packet processing, line-rate switching and protocol offload in communications equipment.
• Data Center Acceleration — Implement custom acceleration pipelines and large on-chip buffers for low-latency data-path acceleration and compute offload.
• Telecommunications Infrastructure — Deploy in backplane and module applications that require dense I/O and substantial logic and memory resources.
• Industrial Systems — Integrate into control, monitoring and signal processing systems that demand industrial temperature operation and a high degree of programmable logic.

Unique Advantages

• Massive Programmable Capacity: 2.11 million logic elements enable complex system integration within a single device, reducing external components.
• Substantial On‑Chip Memory: 140.5 million bits of RAM support large buffers, tables and state storage for data‑intensive algorithms.
• High I/O Count: 688 I/Os allow wide parallel interfaces and multiple high-speed connections without extensive multiplexing.
• Industrial Temperature Range: Rated from -40°C to 100°C to meet the needs of harsh or temperature-variable deployments.
• Compact FCBGA Package: 1760-pin BBGA (1760-FBGA, 42.5x42.5) provides high pin density in a compact footprint for board-level integration.
• Family-Level Performance & Efficiency: Benefits from Stratix 10 family innovations such as the Hyperflex core architecture and Intel 14 nm FinFET process as documented for the device family.

Why Choose 1SG211HN1F43I2LG?

The 1SG211HN1F43I2LG delivers a combination of large programmable logic capacity, substantial on-chip memory and high I/O density in an industrial-grade, surface-mount package. It is well suited to system designs that require extensive custom logic, high bandwidth data handling and reliable operation across a wide temperature range.

Backed by the Stratix 10 family technology documented in the device overview, this part offers a scalable platform for advanced communications, data center and industrial applications where integration density, performance and deterministic programmable behavior are priorities.

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