1SG211HN1F43I2VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2110000 1760-BBGA, FCBGA

Quantity 144 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs263750Number of Logic Elements/Cells2110000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits140509184

Overview of 1SG211HN1F43I2VG – Stratix® 10 GX Field Programmable Gate Array (FPGA), 2,110,000 logic elements

The 1SG211HN1F43I2VG is an Intel Stratix® 10 GX FPGA device built on the Stratix 10 family architecture. It combines the Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process innovations from the Stratix 10 family with per-device specifications that include 2,110,000 logic elements, 140,509,184 total RAM bits, and 688 user I/O.

Designed for high-bandwidth, high-performance system designs, this industrial-grade surface-mount FPGA is intended for applications that require large programmable fabric, extensive on-chip memory, and a broad I/O complement, while operating across a wide voltage and temperature range.

Key Features

  • Core architecture Leverages the Intel Stratix 10 family innovations such as the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) technology described for the Stratix 10 GX/SX devices.
  • Logic capacity Provides 2,110,000 logic elements for large-scale programmable designs and complex custom logic implementations.
  • On-chip memory 140,509,184 total RAM bits to support deep buffering, large lookup tables, and memory-intensive algorithms.
  • I/O and interface density 688 user I/O pins to accommodate extensive external interfacing, multiple high-speed lanes, and diverse peripheral connectivity.
  • Power and supply Operates from a core voltage range of 770 mV to 970 mV, allowing designs to target the specified on-chip power domains.
  • Package and mounting Supplied in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) FCBGA package for high-density board integration and surface-mount assembly.
  • Industrial temperature range Rated for operation from −40 °C to 100 °C to meet industrial-environment deployment requirements.
  • Standards and compliance RoHS compliant, enabling environmentally conscious designs and compliance with common regulatory requirements.

Typical Applications

  • High-performance networking Use the large logic fabric and extensive I/O to implement packet processing, forwarding engines, and protocol offload for network infrastructure.
  • Data center acceleration Deploy the device for hardware acceleration, custom compute kernels, and data-path processing where large on-chip RAM and logic capacity are required.
  • Telecommunications and backplane systems Leverage the I/O density and Stratix 10 family transceiver capabilities (as documented for the family) for multi-lane links and backplane interfacing.

Unique Advantages

  • Substantial programmable capacity: 2,110,000 logic elements provide the headroom to implement complex, multi-function designs without immediate migration to larger devices.
  • Large embedded memory: 140,509,184 RAM bits enable on-chip buffering and algorithm acceleration that reduce dependency on external memory.
  • High I/O count: 688 I/O pins support dense external connectivity for multi-channel systems and high-pin-count peripherals.
  • Industrial robustness: Specified operation from −40 °C to 100 °C suits demanding environments and industrial-grade deployments.
  • Industry-standard packaging: 1760-FBGA (42.5 × 42.5 mm) package facilitates integration into high-density PCBs and established assembly processes.
  • Family-level innovations: Benefits from Stratix 10 family technologies such as the Hyperflex architecture and 14 nm FinFET process for enhanced performance and power characteristics (as documented for the Stratix 10 family).

Why Choose 1SG211HN1F43I2VG?

This Stratix® 10 GX FPGA part is positioned for engineers and system designers who require a high-capacity, industrial-grade programmable device with extensive on-chip memory and a large I/O complement. It brings the Stratix 10 family innovations into designs that demand significant logic resources and memory while supporting a wide operating temperature and a defined core voltage range.

Choose the 1SG211HN1F43I2VG when your project requires scalable programmable fabric, robust industrial operation, and a package suitable for high-density board-level integration—backed by the Stratix 10 family architecture and feature set described in the device documentation.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time details for 1SG211HN1F43I2VG. Our team can assist with sourcing and technical clarifications tailored to your design requirements.

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