1SG166HN2F43E2LG

The 1SG166HN2F43E2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA (1760-FBGA) package optimized for high-capacity, high-bandwidth designs. It combines a large logic fabric with substantial on-chip RAM and extensive I/O to address demanding applications that require significant processing and connectivity resources.

Built on the Stratix 10 family architecture, this device leverages series-level innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate process to provide a platform intended for advanced communications, compute acceleration, and high-speed I/O implementations.

Key Features

• Logic Capacity  1,660,000 logic elements provide high-density programmable fabric for complex algorithms, packet processing, and custom accelerators.
• On-Chip Memory  125,829,120 total RAM bits enable large buffering, lookup tables, and on-chip data stores for low-latency processing.
• I/O and Packaging  688 user I/Os in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package support extensive external connectivity while maintaining a surface-mount form factor.
• Power and Core Voltage  Core voltage specified from 820 mV to 880 mV to support the device’s high-density programmable fabric.
• Operating Range & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance for global manufacturing requirements.
• Series-Level Architecture  Stratix 10 series innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology (series features documented in the Stratix 10 overview) underpin the device’s performance and efficiency.
• High-Performance I/O and Transceiver Technology  Series-level transceiver and IP features described in the Stratix 10 documentation (including high-speed transceiver capabilities and hard IP blocks for protocols such as PCI Express and Ethernet) provide the platform for high-bandwidth system designs.
• Mounting  Surface mount package suitable for modern PCB assembly flows.

Typical Applications

• High-Speed Networking and Telecom  Leverage the device’s large logic capacity, on-chip RAM, and series-level high-speed transceiver capabilities for packet processing, line cards, and backplane interfaces.
• Data Center Acceleration  Implement custom acceleration engines and large on-chip buffers for compute offload and data-path processing where high logic density and RAM are required.
• High-Bandwidth I/O Systems  Use the extensive I/O count and advanced packaging to integrate multiple high-speed interfaces and PHYs for switch, router, and chassis designs.

Unique Advantages

• High Logic Density: With 1,660,000 logic elements, the device supports complex, large-scale FPGA designs without external partitioning.
• Substantial On-Chip Memory: 125,829,120 total RAM bits reduce reliance on external memory for buffering and low-latency storage.
• Broad I/O Capability: 688 I/Os in a 1760-FBGA footprint enable extensive peripheral and high-speed interface integration on a single device.
• Optimized Core Power Window: Core supply range of 820 mV–880 mV supports the Stratix 10 core power profile for high-density logic operation.
• Extended Temperature Grade: Rated for 0 °C to 100 °C operation to meet a wide set of commercial and demanding system requirements.
• Series-Level High-Performance Architecture: Built on Stratix 10 family technologies (including Hyperflex architecture and 14 nm tri-gate process) to support designs that demand high throughput and efficiency.

Why Choose 1SG166HN2F43E2LG?

The 1SG166HN2F43E2LG positions itself as a high-capacity Stratix 10 GX FPGA option for designers who need significant programmable logic, large on-chip RAM, and extensive I/O in a compact BGA package. Its combination of 1,660,000 logic elements, 125,829,120 RAM bits, and 688 I/Os makes it suitable for applications requiring on-device compute and high-bandwidth connectivity.

As part of the Intel Stratix 10 family, this device leverages documented series-level architectural features to provide a scalable platform for advanced communications, acceleration, and high-performance I/O systems, delivering a balance of integration and capability for long-term system designs.

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