1SG166HN1F43I1VG

The 1SG166HN1F43I1VG is a Stratix® 10 GX FPGA configured for high-density logic and extensive I/O in a 1760-BBGA FCBGA package. Built on the Stratix 10 GX device family architecture, it combines Intel Hyperflex™ core innovations and Intel 14 nm tri-gate (FinFET) process technology to address advanced bandwidth and processing requirements.

This device targets applications that need large programmable logic capacity, substantial on-chip memory, and high-speed connectivity while operating across industrial temperature ranges and a low core voltage domain.

Key Features

• Core Architecture  Intel Hyperflex™ core architecture from the Stratix 10 GX family, offering enhanced core performance compared to previous generation high-performance FPGAs.
• Logic Capacity  1,660,000 logic elements, providing high-density programmable logic for complex designs.
• On‑Chip Memory  125,829,120 total RAM bits with the family’s M20K internal SRAM memory block architecture for flexible embedded memory configurations.
• I/O and Connectivity  688 general-purpose I/O pins; device family supports heterogeneous 3D SiP transceiver tiles and high-speed transceiver capabilities for demanding communications and backplane interfaces.
• DSP and Compute  Variable-precision DSP blocks available in the Stratix 10 family, supporting advanced signal processing implementations.
• Power and Voltage  Core voltage supply range: 770 mV to 970 mV for low-voltage core operation.
• Package and Mounting  1760-BBGA (FCBGA) surface-mount package; supplier device package: 1760-FBGA (42.5 × 42.5 mm) for dense board integration.
• Temperature and Grade  Industrial grade operation with an operating temperature range of −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑performance Networking  Used in switches and routers where large programmable logic and extensive I/O drive packet processing and protocol adaptation.
• Data Center Acceleration  Suitable for FPGA-based acceleration tasks that require substantial logic resources and on-chip memory for buffering and compute.
• Telecommunications and Backplane Systems  Applies to systems requiring high-speed transceiver interfaces and dense I/O for multi‑lane links and aggregation.
• Advanced Signal Processing  Ideal for DSP-intensive workloads leveraging variable-precision DSP blocks and abundant on-chip RAM.

Unique Advantages

• High Logic Density: 1,660,000 logic elements enable complex, large-scale FPGA implementations without partitioning across multiple devices.
• Large Embedded Memory: 125,829,120 total RAM bits and M20K memory blocks allow large buffering and data‑path designs within the device.
• Extensive I/O and High‑Speed Connectivity: 688 I/O pins and Stratix 10 GX family transceiver technologies support demanding interface and bandwidth requirements.
• Low‑Voltage Core Operation: 770 mV to 970 mV core supply range supports modern low-power system architectures.
• Industrial Temperature Range: −40 °C to 100 °C operation enables deployment in temperature‑challenging environments.
• Dense, Production‑Ready Package: 1760-BBGA (42.5 × 42.5 mm) provides a compact, high-pin-count solution for system-level integration.

Why Choose 1SG166HN1F43I1VG?

1SG166HN1F43I1VG brings the Stratix 10 GX device family innovations—Hyperflex core architecture and Intel 14 nm FinFET process—into a single, high-capacity FPGA well suited for complex, bandwidth-intensive designs. With 1.66 million logic elements, large on-chip memory, extensive I/O, and industrial temperature rating, it is positioned for applications that demand significant programmable resources and reliable operation across environments.

This device is appropriate for engineering teams building high-performance networking, communications, data center acceleration, or advanced signal processing systems who require a highly integrated FPGA platform backed by Stratix 10 family documentation and architecture.

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