1SG166HN1F43E2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1660000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 601 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 207500 | Number of Logic Elements/Cells | 1660000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 125829120 |
Overview of 1SG166HN1F43E2VG – Stratix® 10 GX FPGA IC, 1,660,000 logic elements, 688 I/O, 1760-BBGA
The 1SG166HN1F43E2VG is a Stratix® 10 GX field programmable gate array (FPGA) device designed for high-performance, high-density digital designs. It leverages the Stratix 10 family innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology described in the device overview.
Targeted at advanced communications, compute acceleration and signal-processing applications, this device combines a very large logic capacity, abundant on-chip RAM and a high I/O count to support complex system integration and high-bandwidth interfacing.
Key Features
- Core architecture — Based on the Stratix 10 family with the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process as described in the device overview.
- Logic capacity — 1,660,000 logic elements for large-scale, highly parallel designs.
- On-chip memory — 125,829,120 total RAM bits; Stratix 10 family includes M20K internal SRAM memory block architecture.
- I/O and packaging — 688 I/O pins; surface-mount 1760-BBGA, FCBGA package. Supplier device package listed as 1760-FBGA (42.5 × 42.5 mm).
- Power and supply — Operating core supply range 770 mV to 970 mV.
- Temperature and grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
- High-speed connectivity (family capabilities) — Stratix 10 family-level transceiver features include heterogeneous 3D SiP transceiver tiles, support for up to 96 full-duplex transceiver channels and transceiver data rates referenced in the family overview.
- System-level IP (family capabilities) — The Stratix 10 family overview documents hard IP such as PCI Express Gen3 and high-performance memory controllers and DSP resources suitable for demanding signal-processing tasks.
- Environmental compliance — RoHS compliant.
Typical Applications
- High-speed networking and switching — Large logic capacity and family-level transceiver capabilities make this device suitable for packet processing, switch fabrics and line cards that require wide I/O bandwidth and programmable logic.
- Data center acceleration — Dense logic and abundant on-chip RAM support custom acceleration engines and data-path implementations used for compression, encryption or inline processing.
- High-performance signal processing — On-chip memory and the Stratix 10 family DSP resources enable radio, radar and communications signal-processing workloads.
- Custom compute and prototyping — High logic element count and extensive I/O are useful for FPGA-based prototyping, hardware emulation and bespoke compute blocks where integration density matters.
Unique Advantages
- High logic density: 1,660,000 logic elements allow complex functions and large-scale parallelism within a single device.
- Large embedded memory: 125,829,120 total RAM bits provide substantial on-chip storage for buffering, FIFOs and local data storage.
- Extensive external interfacing: 688 I/O pins support dense connectivity to peripherals, memory interfaces and high-speed PHYs.
- Advanced package options: 1760-BBGA (FCBGA) form factor and supplier package 1760-FBGA (42.5 × 42.5 mm) suitable for high-pin-count, high-performance board designs.
- Extended operating range and compliance: Extended grade operation from 0 °C to 100 °C and RoHS compliance support deployment in a range of controlled-environment applications.
- Stratix 10 family innovations: Family-level features such as the Hyperflex architecture, FinFET process and high-performance transceiver options provide a modern platform foundation for demanding designs.
Why Choose 1SG166HN1F43E2VG?
This Stratix 10 GX device is positioned for designers who need a combination of very high logic capacity, significant on-chip RAM and a large I/O footprint in a single FPGA package. It is well suited for systems requiring substantial programmable logic resources and high-bandwidth external interfacing.
Choosing 1SG166HN1F43E2VG gives you a Stratix 10 family device that leverages documented architecture-level innovations — enabling scalable designs that can take advantage of the family’s high-performance building blocks and supporting documentation.
Request a quote or submit a product inquiry to get pricing and availability for 1SG166HN1F43E2VG and to discuss how this device fits your next high-performance FPGA design.

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