1SG166HN1F43E2VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1660000 1760-BBGA, FCBGA

Quantity 601 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs207500Number of Logic Elements/Cells1660000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits125829120

Overview of 1SG166HN1F43E2VG – Stratix® 10 GX FPGA IC, 1,660,000 logic elements, 688 I/O, 1760-BBGA

The 1SG166HN1F43E2VG is a Stratix® 10 GX field programmable gate array (FPGA) device designed for high-performance, high-density digital designs. It leverages the Stratix 10 family innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology described in the device overview.

Targeted at advanced communications, compute acceleration and signal-processing applications, this device combines a very large logic capacity, abundant on-chip RAM and a high I/O count to support complex system integration and high-bandwidth interfacing.

Key Features

  • Core architecture — Based on the Stratix 10 family with the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process as described in the device overview.
  • Logic capacity — 1,660,000 logic elements for large-scale, highly parallel designs.
  • On-chip memory — 125,829,120 total RAM bits; Stratix 10 family includes M20K internal SRAM memory block architecture.
  • I/O and packaging — 688 I/O pins; surface-mount 1760-BBGA, FCBGA package. Supplier device package listed as 1760-FBGA (42.5 × 42.5 mm).
  • Power and supply — Operating core supply range 770 mV to 970 mV.
  • Temperature and grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
  • High-speed connectivity (family capabilities) — Stratix 10 family-level transceiver features include heterogeneous 3D SiP transceiver tiles, support for up to 96 full-duplex transceiver channels and transceiver data rates referenced in the family overview.
  • System-level IP (family capabilities) — The Stratix 10 family overview documents hard IP such as PCI Express Gen3 and high-performance memory controllers and DSP resources suitable for demanding signal-processing tasks.
  • Environmental compliance — RoHS compliant.

Typical Applications

  • High-speed networking and switching — Large logic capacity and family-level transceiver capabilities make this device suitable for packet processing, switch fabrics and line cards that require wide I/O bandwidth and programmable logic.
  • Data center acceleration — Dense logic and abundant on-chip RAM support custom acceleration engines and data-path implementations used for compression, encryption or inline processing.
  • High-performance signal processing — On-chip memory and the Stratix 10 family DSP resources enable radio, radar and communications signal-processing workloads.
  • Custom compute and prototyping — High logic element count and extensive I/O are useful for FPGA-based prototyping, hardware emulation and bespoke compute blocks where integration density matters.

Unique Advantages

  • High logic density: 1,660,000 logic elements allow complex functions and large-scale parallelism within a single device.
  • Large embedded memory: 125,829,120 total RAM bits provide substantial on-chip storage for buffering, FIFOs and local data storage.
  • Extensive external interfacing: 688 I/O pins support dense connectivity to peripherals, memory interfaces and high-speed PHYs.
  • Advanced package options: 1760-BBGA (FCBGA) form factor and supplier package 1760-FBGA (42.5 × 42.5 mm) suitable for high-pin-count, high-performance board designs.
  • Extended operating range and compliance: Extended grade operation from 0 °C to 100 °C and RoHS compliance support deployment in a range of controlled-environment applications.
  • Stratix 10 family innovations: Family-level features such as the Hyperflex architecture, FinFET process and high-performance transceiver options provide a modern platform foundation for demanding designs.

Why Choose 1SG166HN1F43E2VG?

This Stratix 10 GX device is positioned for designers who need a combination of very high logic capacity, significant on-chip RAM and a large I/O footprint in a single FPGA package. It is well suited for systems requiring substantial programmable logic resources and high-bandwidth external interfacing.

Choosing 1SG166HN1F43E2VG gives you a Stratix 10 family device that leverages documented architecture-level innovations — enabling scalable designs that can take advantage of the family’s high-performance building blocks and supporting documentation.

Request a quote or submit a product inquiry to get pricing and availability for 1SG166HN1F43E2VG and to discuss how this device fits your next high-performance FPGA design.

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