1SG165HU3F50I2VG

The 1SG165HU3F50I2VG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) IC offering high logic density and extensive I/O connectivity in a 2397-BBGA FCBGA package. This industrial-grade device is designed for advanced, high-bandwidth applications that require large programmable fabric, significant on-chip memory, and robust I/O resources.

Built on the Stratix® 10 family architecture, the device is part of a platform that emphasizes high core performance and power efficiency. The combination of 1,650,000 logic elements, 119,537,664 bits of on-chip RAM, and 704 I/Os makes this part suitable for demanding communications, compute acceleration, and data processing roles where integration and capacity matter.

Key Features

• Core Architecture  Based on the Intel Stratix® 10 GX family architecture, delivering high-performance FPGA fabric suitable for advanced processing and bandwidth-centric applications.
• Logic Capacity  1,650,000 logic elements provide substantial programmable resources for complex digital designs and large-scale hardware acceleration.
• On-Chip Memory  119,537,664 total RAM bits enable large buffering, caching, and data-path memory requirements inside the FPGA fabric.
• I/O and Connectivity  704 user I/Os support extensive external interfacing and system integration; family-level transceiver capabilities include high-speed serial links and hardened protocol IP for demanding data paths.
• Power and Voltage  Core voltage supply range is 770 mV to 970 mV, allowing integration into low-voltage system power rails.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Package and Mounting  2397-BBGA (FCBGA) package in a surface-mount form factor (supplier package: 2397-FBGA, FC, 50×50) for compact board-level deployment.
• Standards and Compliance  RoHS compliant to support regulatory and assembly requirements.

Typical Applications

• High‑Performance Networking  Large programmable fabric and extensive I/O make this device suitable for packet processing, switch/router front-ends, and backplane interface logic.
• Data Center Acceleration  High logic density and abundant on-chip RAM support compute acceleration, custom packet processing, and high-throughput data-plane functions.
• Telecommunications Infrastructure  Designed for bandwidth- and latency-sensitive subsystems such as transport, fronthaul/PHY processing, and protocol termination.
• Test, Measurement, and Instrumentation  The combination of logic resources, memory, and I/O count supports high-channel-count acquisition, real-time signal processing, and custom instrumentation logic.

Unique Advantages

• High Logic Density: 1,650,000 logic elements enable consolidation of large multi-function designs into a single device, reducing BOM and board complexity.
• Substantial Embedded Memory: 119,537,664 bits of on-chip RAM provide deep buffering and localized data storage for high-throughput designs.
• Extensive I/O Capability: 704 I/Os allow flexible interfacing to multiple high-speed buses, peripherals, and external devices without external multiplexing.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, supporting deployment in industrial and harsh-environment applications.
• Compact Surface-Mount Packaging: 2397-BBGA FCBGA surface-mount package (50×50 supplier footprint) delivers high integration density for space-constrained boards.
• Low-Voltage Core Operation: 770 mV to 970 mV core voltage range enables efficient power delivery and integration with modern low-voltage power architectures.

Why Choose 1SG165HU3F50I2VG?

The 1SG165HU3F50I2VG positions itself as a high-capacity, industrial-grade FPGA option within the Intel Stratix® 10 GX family, combining large logic count, significant on-chip RAM, and extensive I/O in a compact FCBGA package. It is suited for designers who need to implement complex, high-throughput processing, networking, or acceleration functions on a single programmable device.

Choosing this part provides a path to consolidate functionality, reduce external components, and leverage the Stratix® 10 family architecture for scalable, performance-oriented system designs documented in the device overview.

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