1SG165HU2F50E2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 1650000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 314 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 206250 | Number of Logic Elements/Cells | 1650000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 119537664 |
Overview of 1SG165HU2F50E2VG – Stratix® 10 GX FPGA, 1,650,000 logic elements, 704 I/O, 2397-FCBGA
The 1SG165HU2F50E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 2397 FCBGA package. It pairs high logic density with large on-chip RAM and broad I/O capability to address demanding bandwidth and processing applications.
Built on the Stratix 10 GX family architecture, this device leverages the family’s Hyperflex core innovations and high‑performance transceiver technology to deliver increased core performance and improved power efficiency for advanced communications, networking and compute-oriented designs.
Key Features
- Logic Capacity — 1,650,000 logic elements, providing high density for complex custom logic and large-scale FPGA implementations.
- On‑chip Memory — 119,537,664 total RAM bits to support large frame buffers, packet queues, and state storage without immediate external memory dependence.
- I/O Count — 704 user I/O pins, enabling wide parallel interfaces and dense board-level connectivity.
- Package & Mounting — 2397-BBGA (FCBGA) surface-mount package suitable for high-pin-count board designs.
- Core Voltage Range — 770 mV to 970 mV core supply, supporting low-voltage operation consistent with Stratix 10 family power domains.
- Operating Range & Grade — Extended grade with an operating temperature range of 0°C to 100°C for deployment in temperature-demanding commercial and enterprise environments.
- Family Innovations — Stratix 10 GX family features cited in the device overview include the Intel Hyperflex™ core architecture, 14 nm tri-gate process, heterogeneous 3D SiP transceiver tiles, and high-speed transceivers with data rates up to 28.3 Gbps.
- Compute & DSP — Family-level variable-precision DSP blocks and hardened IP for high-throughput signal processing are available in the Stratix 10 GX lineup to accelerate compute-intensive algorithms.
- Compliance — RoHS compliant.
Typical Applications
- High‑Performance Networking — Use the device’s high logic count, substantial on-chip RAM, and high-speed transceiver capabilities for packet processing, switch fabric, and line-card implementations.
- Data Center Acceleration — Deploy as a hardware accelerator for compute or encryption workloads that benefit from dense logic and large local memory.
- Telecommunications Infrastructure — Implement PHY, FEC, and protocol offload functions using the family’s transceiver and DSP capabilities.
- Advanced Prototyping and System Integration — Leverage the large I/O count and high logic capacity for complex prototype boards and system‑level integration of custom peripherals.
Unique Advantages
- High Logic Density: 1,650,000 logic elements enable complex designs and large-scale integration on a single device, reducing external component needs.
- Large On‑Chip Memory: Nearly 120 Mbits of RAM supports buffering and stateful algorithms, minimizing latency to external memory.
- Extensive I/O Connectivity: 704 I/Os allow broad parallel interfaces and flexible board‑level routing for multi-channel systems.
- Family‑Level Performance Innovations: Hyperflex core architecture and 14 nm process technology deliver the family improvements in core performance and power efficiency described in the device overview.
- High‑Speed Transceiver Support: Stratix 10 GX family transceivers supporting multi‑Gbps links are suitable for demanding serial communication requirements.
- Commercial Extended Grade: 0°C to 100°C operating range and extended-grade designation for reliable operation in enterprise and industrial-adjacent deployments.
Why Choose 1SG165HU2F50E2VG?
The 1SG165HU2F50E2VG positions itself as a high-capacity Stratix 10 GX FPGA option for designers who require substantial logic resources, large embedded RAM, and broad I/O in a single, surface‑mount package. Its specification aligns with demanding networking, compute acceleration, and communications use cases where integration and on‑chip performance matter.
Buying into the Stratix 10 GX family gives access to architectural innovations documented in the device overview—such as the Hyperflex core and advanced transceiver technology—supporting scalability across performance-sensitive designs while maintaining compliance and extended operating capability.
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