1SG165HN3F43I3VGAS

The 1SG165HN3F43I3VGAS is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760-BBGA package. It combines high-density programmable logic with a large on-chip memory array and a high I/O count to address demanding processing and high-bandwidth applications.

Built on the Stratix® 10 GX family architecture, this device leverages the family-level innovations documented in the product overview, providing a platform well suited for networking, communications, and compute-accelerated designs that require abundant logic, RAM, and transceiver-capable I/O.

Key Features

• Programmable Logic 1,650,000 logic elements for large-scale, complex digital designs.
• On‑Chip Memory 119,537,664 total RAM bits to support large buffering, packet processing, and state storage.
• I/O Density 688 I/O pins to support wide external interfaces and high channel counts.
• Family-Level Architecture Based on the Stratix® 10 GX family innovations, including the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process as described in the device overview.
• High-Speed Interfaces Stratix® 10 family transceiver and interface technologies (family overview documents support high-speed serial channels and hard IP blocks for PCI Express and Ethernet).
• Power and Supply Core voltage supply range of 770 mV to 970 mV to match system power domains.
• Package and Mounting 1760-BBGA (supplier package listed as 1760-FBGA, 42.5 × 42.5 mm) in a surface-mount FCBGA form factor for high-density board integration.
• Operating Range Industrial-grade operation from −40 °C to 100 °C and RoHS compliance for environmental conformity.

Typical Applications

• High‑Speed Networking Use the device’s large logic count and high I/O density to implement packet processing, switching, and protocol offload functions.
• Telecommunications Infrastructure Suitable for line cards, fronthaul/backhaul systems and other telecom gear requiring dense logic and on‑chip RAM for buffering and FEC support as described in the family overview.
• Data Center Acceleration Deploy as a programmable accelerator for custom workloads that demand large FPGA fabric and substantial memory resources.
• Test & Measurement Implement flexible, high-channel-count signal acquisition and real‑time processing systems that benefit from abundant I/O and on-chip RAM.

Unique Advantages

• High logic capacity: 1,650,000 logic elements allow consolidation of large functions into a single device, reducing board-level complexity.
• Substantial on‑chip RAM: 119,537,664 bits of RAM enable large buffers, lookup tables, and state machines without relying solely on external memory.
• High I/O count: 688 I/O pins support dense external interface requirements and multi-lane connectivity.
• Industrial temperature grade: Rated from −40 °C to 100 °C for deployment in industrial environments.
• Compact, high-density package: 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) FCBGA package supports high-pin-count integration in space-constrained boards.
• Compliant and manufacturable: Surface-mount FCBGA mounting and RoHS compliance simplify assembly and environmental qualification.

Why Choose 1SG165HN3F43I3VGAS?

This Stratix® 10 GX FPGA delivers a combination of very large programmable logic, significant on-chip memory, and extensive I/O that suits complex, high-throughput designs. The device aligns with the Stratix® 10 family innovations detailed in the device overview, providing a platform engineered for demanding networking, telecom, and compute-accelerated applications.

Engineers and procurement teams will find long-term value in the device’s scalability within the Stratix® 10 family, industrial operating range, and high-density package options—facilitating compact, robust system designs that leverage available family-level IP and architecture features.

Request a quote or contact sales to discuss availability, lead times, and integration support for the 1SG165HN3F43I3VGAS Stratix® 10 GX FPGA.