1SG165HN3F43I2VG

The 1SG165HN3F43I2VG is an Intel Stratix® 10 GX FPGA in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package. This industrial-grade device delivers high logic density, abundant on-chip RAM, and extensive I/O for compute- and bandwidth-intensive embedded and system-level designs.

Built on Stratix 10 family innovations, the device combines a modern core architecture with high-speed transceiver and memory support to address applications requiring large logic capacity, heavy on-chip buffering, and numerous physical I/O channels.

Key Features

• Logic Density  1,650,000 logic elements for implementing large-scale custom hardware functions and complex control logic.
• Embedded Memory  119,537,664 total RAM bits of on-chip memory to support large buffers, lookup tables, and state storage.
• I/O Count  688 user I/O pins to interface with high-pin-count front-end systems, mezzanines, or backplane connectors.
• Package & Mounting  1760-BBGA (FCBGA) surface-mount package (1760-FBGA, 42.5 × 42.5 mm) suited for high-density board designs.
• Power and Voltage  Core voltage supply range 770 mV to 970 mV, matching modern low-voltage FPGA core domains.
• Operating Range  Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Stratix 10 Family Innovations  Includes Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology as described for the Stratix 10 family, delivering increased core performance and power efficiency.
• High-speed Interfaces and IP (Family Features)  Stratix 10 family devices provide high-performance transceivers (family-level data rates up to 28.3 Gbps), hard PCI Express Gen3 x16 IP, hard 10G Ethernet/FEC, and hard memory controller support for DDR4 up to 2666 Mbps per pin, enabling complex connectivity and protocol offload.
• Compliance  RoHS compliant.

Typical Applications

• High‑performance Networking  Use the device’s high I/O count, high-speed transceiver capability (family-level), and on-chip memory for packet processing, line cards, and switch fabric acceleration.
• Data Center Accelerators  Leverage the large logic capacity and extensive RAM to implement custom compute kernels, hardware accelerators, and offload engines.
• Telecommunications and Backplane Systems  The combination of many I/O and Stratix 10 family transceiver features supports backplane interfaces, PHY integration, and protocol handling.
• Signal Processing and DSP  Large logic resources and on-chip memory enable high-throughput DSP pipelines and multi-channel signal processing implementations.

Unique Advantages

• High integration density: 1,650,000 logic elements and 119,537,664 RAM bits reduce external component count and simplify board-level partitioning for complex designs.
• Extensive I/O capacity: 688 user I/Os provide flexibility for multi-channel front-end interfaces, mezzanine modules, or dense connector implementations.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in demanding temperature environments.
• Modern low-voltage core: 770 mV–970 mV supply range aligns with contemporary low-power FPGA core domains for efficient power delivery design.
• Family-level performance innovations: Stratix 10 family features such as Hyperflex architecture and 14 nm FinFET technology provide a foundation for high core performance and power efficiency in compute- and bandwidth-focused applications.
• Standards-focused I/O and IP support: Family-provided hard IP options (PCIe Gen3, 10G Ethernet/FEC, DDR4 PHY) enable protocol offload and faster time-to-deployment when used within the Stratix 10 ecosystem.

Why Choose 1SG165HN3F43I2VG?

1SG165HN3F43I2VG positions itself for system designs that demand large FPGA fabric, substantial on-chip memory, and broad I/O. Its Stratix 10 GX lineage brings family-level innovations such as the Hyperflex architecture and advanced process technology, allowing designers to implement complex, high-throughput functions while addressing power and integration needs.

This industrial-grade device is suited for engineers building high-bandwidth networking gear, data center accelerators, telecom line cards, and DSP-heavy systems that require a combination of logic capacity, memory, and extensive physical I/O in a compact BGA footprint.

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