1SG165HN3F43E2VG

The 1SG165HN3F43E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-ball BGA package. Built on the Stratix 10 family architecture, the device leverages the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process to address high-bandwidth, high-performance applications.

With 1,650,000 logic elements, substantial on-chip RAM and extensive I/O, this device targets advanced communications, data center, and compute-accelerator applications that require dense logic capacity, high-speed transceivers and integrated system features.

Key Features

• Logic Capacity  1,650,000 logic elements to support large-scale logic implementations and complex designs.
• On-Chip Memory  119,537,664 total RAM bits for buffering, caching and tightly coupled memory needs.
• I/O Density  688 user I/O pins, enabling broad peripheral and high-speed interface connectivity.
• High-Speed Transceivers and I/O  Family-level transceiver technologies include multi-gigabit channels with data rates up to 28.3 Gbps and support for multiple full-duplex transceiver channels.
• Core Architecture  Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) process technology as described for the Stratix 10 family.
• Hard IP Options (Family)  Family features include hard PCI Express Gen3 x16 IP, 10G Ethernet and other protocol IP blocks as part of the Stratix 10 device overview.
• Power Supply Range  Specified operating core voltage range from 770 mV to 970 mV for core power domains.
• Package  1760-BBGA (FCBGA) package; supplier device package listed as 1760-FBGA with a 42.5 × 42.5 mm footprint.
• Mounting & Grade  Surface mount device with Extended grade classification.
• Operating Temperature  Rated for 0°C to 100°C operation.
• Compliance  RoHS-compliant.

Typical Applications

• High‑performance networking  Implements packet processing, switching and line-rate protocol functions using dense logic and high-speed transceivers.
• Data center acceleration  Serves as a compute or I/O accelerator where large logic capacity and on-chip RAM enable custom processing pipelines.
• Telecom and transport  Handles backplane and module-level high-speed links and protocol offload with integrated transceiver and hard IP support.
• System prototypes and advanced SoC designs  Supports complex FPGA-based system integration and hardware/software partitioning in advanced development platforms.

Unique Advantages

• Large logic fabric: 1,650,000 logic elements provide the density needed for complex algorithms and broad system functions without external logic.
• Substantial on‑chip RAM: 119,537,664 RAM bits reduce external memory dependence for buffering and stateful processing.
• Extensive I/O and package integration: 688 I/O pins in a 1760-BBGA footprint support integration into compact, high-density boards.
• High-speed connectivity: Family-level transceiver capabilities and hard IP options enable high-throughput interfaces and protocol offloads.
• Optimized power domains: Defined core voltage range (770 mV–970 mV) supports controlled power management for core domains.
• Extended temperature grade: Rated for 0°C to 100°C to match a range of deployment environments.

Why Choose 1SG165HN3F43E2VG?

This Stratix 10 GX FPGA variant combines large logic capacity, extensive on-chip memory and a high I/O count in a 1760-BBGA package to address high-bandwidth, compute-intensive designs. The device uses Intel’s Hyperflex architecture and 14 nm process technology as outlined for the Stratix 10 family, providing a platform oriented to advanced communications, data center and system-level FPGA integration.

Choose 1SG165HN3F43E2VG for designs that require dense programmable logic, significant embedded RAM and support for high-speed interfaces, all backed by Intel’s Stratix 10 device family engineering and ecosystem resources.

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