1SG165HN1F43I2VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1650000 1760-BBGA, FCBGA

Quantity 854 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs206250Number of Logic Elements/Cells1650000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits119537664

Overview of 1SG165HN1F43I2VG – Stratix® 10 GX Field Programmable Gate Array (FPGA)

The 1SG165HN1F43I2VG is a Stratix® 10 GX family FPGA device designed for high-bandwidth, high-performance programmable systems. It leverages the Stratix 10 GX family architecture innovations to address advanced networking, data center, and signal-processing applications that require large logic capacity and extensive I/O.

As a member of the Stratix 10 GX family, the device benefits from family-level innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology, delivering significant core performance improvements for demanding designs.

Key Features

  • Core Architecture  Based on the Stratix 10 GX family architecture and Intel Hyperflex core technology, which the family overview cites as delivering increased core performance.
  • Logic Capacity  1,650,000 logic elements (logic cells) to implement large, complex designs.
  • On‑Chip Memory  119,537,664 total RAM bits of embedded on-chip memory for buffering, lookup tables, and state storage.
  • I/O and Package  688 user I/O pins and a 1760-ball BGA FCBGA package (supplier package: 1760-FBGA, 42.5×42.5 mm) in a surface-mount form factor.
  • Power  Core voltage supply range: 770 mV to 970 mV, supporting the device's high-density fabric requirements.
  • Operating Range and Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
  • Family-Level I/O and Interface Capabilities  Stratix 10 GX family features include advanced high-speed transceivers, hard PCI Express and Ethernet IP options, and support for high-rate external memory interfaces (family-level details referenced from the device overview).

Typical Applications

  • High‑performance networking  Implement packet processing, switching and protocol offload using the device's large logic capacity and extensive I/O.
  • Data center acceleration  Deploy hardware accelerators and custom compute pipelines that leverage 1,650,000 logic elements and large on‑chip memory for low-latency processing.
  • Telecommunications and backplane systems  Integrate with high-speed serial interfaces and advanced transceiver capabilities available in the Stratix 10 GX family for backplane and board-level communications.
  • Advanced signal processing  Build variable-precision DSP pipelines and streaming data paths using the device’s memory and logic resources for real-time processing tasks.

Unique Advantages

  • High logic density: 1,650,000 logic elements provide the capacity needed for large, integrated FPGA designs.
  • Substantial on-chip memory: 119,537,664 bits of RAM reduce external memory dependence and improve throughput for buffering and stateful processing.
  • Extensive I/O and robust packaging: 688 I/O pins in a 1760-ball FCBGA (42.5×42.5 mm) package enable high connector and interface density on modern PCBs.
  • Industrial rating and wide temp range: −40 °C to 100 °C operating range supports deployment in industrial environments.
  • Modern process and architecture (family-level): Stratix 10 GX family innovations such as 14 nm tri-gate technology and the Hyperflex core architecture deliver improved performance and efficiency for compute-heavy tasks.
  • Regulatory compliance: RoHS compliant to support environmental requirements.

Why Choose 1SG165HN1F43I2VG?

The 1SG165HN1F43I2VG combines large logic capacity, substantial on-chip memory, and extensive I/O in a high-density FCBGA package, making it well suited for system designs that demand integrated, high-throughput programmable logic. Its industrial temperature rating and RoHS compliance make it appropriate for long-life, commercial and industrial deployments.

Design teams targeting high-performance networking, data-center acceleration, telecom systems, or advanced signal-processing applications will find the device's combination of resources and family-level architectural innovations valuable for scalable, high-bandwidth implementations.

Request a quote or submit an inquiry to receive pricing and availability information for the 1SG165HN1F43I2VG and to discuss how it can meet your project requirements.

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