1SG165HN1F43I2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1650000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 854 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 206250 | Number of Logic Elements/Cells | 1650000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 119537664 |
Overview of 1SG165HN1F43I2VG – Stratix® 10 GX Field Programmable Gate Array (FPGA)
The 1SG165HN1F43I2VG is a Stratix® 10 GX family FPGA device designed for high-bandwidth, high-performance programmable systems. It leverages the Stratix 10 GX family architecture innovations to address advanced networking, data center, and signal-processing applications that require large logic capacity and extensive I/O.
As a member of the Stratix 10 GX family, the device benefits from family-level innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology, delivering significant core performance improvements for demanding designs.
Key Features
- Core Architecture Based on the Stratix 10 GX family architecture and Intel Hyperflex core technology, which the family overview cites as delivering increased core performance.
- Logic Capacity 1,650,000 logic elements (logic cells) to implement large, complex designs.
- On‑Chip Memory 119,537,664 total RAM bits of embedded on-chip memory for buffering, lookup tables, and state storage.
- I/O and Package 688 user I/O pins and a 1760-ball BGA FCBGA package (supplier package: 1760-FBGA, 42.5×42.5 mm) in a surface-mount form factor.
- Power Core voltage supply range: 770 mV to 970 mV, supporting the device's high-density fabric requirements.
- Operating Range and Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance.
- Family-Level I/O and Interface Capabilities Stratix 10 GX family features include advanced high-speed transceivers, hard PCI Express and Ethernet IP options, and support for high-rate external memory interfaces (family-level details referenced from the device overview).
Typical Applications
- High‑performance networking Implement packet processing, switching and protocol offload using the device's large logic capacity and extensive I/O.
- Data center acceleration Deploy hardware accelerators and custom compute pipelines that leverage 1,650,000 logic elements and large on‑chip memory for low-latency processing.
- Telecommunications and backplane systems Integrate with high-speed serial interfaces and advanced transceiver capabilities available in the Stratix 10 GX family for backplane and board-level communications.
- Advanced signal processing Build variable-precision DSP pipelines and streaming data paths using the device’s memory and logic resources for real-time processing tasks.
Unique Advantages
- High logic density: 1,650,000 logic elements provide the capacity needed for large, integrated FPGA designs.
- Substantial on-chip memory: 119,537,664 bits of RAM reduce external memory dependence and improve throughput for buffering and stateful processing.
- Extensive I/O and robust packaging: 688 I/O pins in a 1760-ball FCBGA (42.5×42.5 mm) package enable high connector and interface density on modern PCBs.
- Industrial rating and wide temp range: −40 °C to 100 °C operating range supports deployment in industrial environments.
- Modern process and architecture (family-level): Stratix 10 GX family innovations such as 14 nm tri-gate technology and the Hyperflex core architecture deliver improved performance and efficiency for compute-heavy tasks.
- Regulatory compliance: RoHS compliant to support environmental requirements.
Why Choose 1SG165HN1F43I2VG?
The 1SG165HN1F43I2VG combines large logic capacity, substantial on-chip memory, and extensive I/O in a high-density FCBGA package, making it well suited for system designs that demand integrated, high-throughput programmable logic. Its industrial temperature rating and RoHS compliance make it appropriate for long-life, commercial and industrial deployments.
Design teams targeting high-performance networking, data-center acceleration, telecom systems, or advanced signal-processing applications will find the device's combination of resources and family-level architectural innovations valuable for scalable, high-bandwidth implementations.
Request a quote or submit an inquiry to receive pricing and availability information for the 1SG165HN1F43I2VG and to discuss how it can meet your project requirements.

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