1SG110HN3F43I3VG

The 1SG110HN3F43I3VG is an Intel Stratix® 10 GX FPGA offering high-capacity programmable logic and advanced family-level features from the Stratix 10 GX/SX device line. Built on the Stratix 10 architecture, this device targets advanced, high-bandwidth applications that require large logic density, significant on-chip memory, and industry-grade operating temperature range.

This device leverages Stratix 10 innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology to deliver family-level improvements in core performance and power efficiency for demanding system designs.

Key Features

• Core architecture  Intel Hyperflex core architecture as described for the Stratix 10 family, delivering increased core performance at 14 nm tri-gate (FinFET) process technology.
• Logic capacity  1,100,000 logic elements (logic cells) to implement large-scale custom logic and control functions.
• On-chip memory  112,197,632 total RAM bits of embedded memory for buffering, packet processing, and data staging.
• I/O density  688 user I/O pins for high fanout external connectivity and complex board-level interfacing.
• Package and mounting  1760-BBGA (FCBGA) supplier device package 1760-FBGA (42.5 × 42.5 mm); surface-mount mounting type for compact high-density boards.
• Power supply range  Core voltage supply range 770 mV to 970 mV to match system power-rail planning.
• Industrial temperature range  Rated for −40 °C to 100 °C operation, suitable for industrial environments.
• Family-level transceiver and I/O capabilities  Stratix 10 family documentation describes high-performance transceivers, fractional-synthesis PLLs, and hard IP such as PCI Express and Ethernet (see family datasheet for details).
• Design flexibility  Family documentation notes support for features such as partial and dynamic reconfiguration and a range of hard IP blocks to accelerate system integration.
• RoHS compliant  Manufactured in compliance with RoHS environmental requirements.

Typical Applications

• High-performance networking and communications  Large logic capacity and family-level transceiver capabilities make this device suited for line cards, switches, and telecom infrastructure requiring high bandwidth.
• Data center acceleration  Dense programmable logic and substantial on-chip RAM support custom compute offload and packet processing functions in server and appliance designs.
• High-speed storage and I/O subsystems  PCI Express and high-rate I/O support described for the family enable implementation of storage controllers and high-throughput interface bridges.
• Advanced signal processing  Large memory and logic resources serve DSP and algorithm acceleration tasks in communications and instrumentation equipment.

Unique Advantages

• High logic density: 1,100,000 logic elements provide the capacity to consolidate multiple functions and reduce external components.
• Substantial on-chip memory: 112,197,632 total RAM bits reduce dependence on external memory for many buffering and processing tasks.
• Extensive I/O count: 688 I/O pins enable complex board-level interfacing and high-pin-count system designs.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in industrial environments.
• Compact, high-density package: 1760-FBGA (42.5 × 42.5 mm) package supports high integration in space-constrained systems.
• Documented family capabilities: Stratix 10 GX/SX family documentation details advanced features such as Hyperflex architecture, FinFET process benefits, and hard IP blocks to assist design planning.

Why Choose 1SG110HN3F43I3VG?

The 1SG110HN3F43I3VG delivers a combination of large programmable logic, significant embedded RAM, and high I/O count in an industrial-temperature, surface-mount BBGA package. As a member of the Intel Stratix 10 GX family, it aligns with family-level innovations—such as the Hyperflex core architecture and 14 nm FinFET technology—that are documented to increase core performance and efficiency for advanced designs.

This device is well suited for engineers and system architects building high-bandwidth networking, compute acceleration, or advanced signal-processing systems who require documented family capabilities, high integration, and industrial temperature support. Detailed family datasheet material is available to guide implementation and system integration.

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