1SG110HN3F43E3XG

The 1SG110HN3F43E3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) delivered in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package. It provides very high logic density and on-chip memory, alongside a large I/O count and the voltage and thermal ranges required for demanding compute and connectivity applications.

Built on the Stratix 10 family innovations, this device benefits from the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology described for the series, enabling designers to address high-bandwidth, high-performance system requirements while managing power and integration constraints.

Key Features

• Core density — 1,100,000 logic elements provide substantial programmable fabric for complex logic, compute and control implementations.
• On-chip memory — 112,197,632 total RAM bits for buffering, state storage and memory-intensive algorithms.
• I/O capacity — 688 I/Os to support wide parallel interfaces, multi-channel data paths and complex board-level connectivity.
• Power domain — Core supply range specified at 820 mV to 880 mV for integration into modern low-voltage power architectures.
• Package and mounting — 1760-BBGA (supplier package 1760-FBGA, 42.5 × 42.5 mm) in a surface-mount form factor to support compact, high-density board designs.
• Thermal and grade — Extended grade operation from 0 °C to 100 °C to meet a broad range of system thermal environments.
• Family-level technologies — Leverages Stratix 10 family innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process; family documentation also describes advanced transceiver, memory and PLL features.
• Compliance — RoHS compliant for regulatory and assembly processes.

Typical Applications

• High-performance networking — Use the large logic fabric and high I/O count to implement packet processing, switch control and line-rate data-plane functions.
• Data center acceleration — Implement custom compute kernels and offload engines that benefit from the device's high logic density and large on-chip RAM.
• Telecommunications and backplane systems — Support multi-channel interfaces and complex protocol engines with plentiful I/Os and family-level transceiver capabilities.
• Test, measurement and instrumentation — High-density logic and memory enable real-time signal processing, pattern generation and capture on demanding test platforms.

Unique Advantages

• High programmable capacity: 1,100,000 logic elements let you integrate sizeable custom logic and accelerators on a single device, reducing system BOM.
• Substantial on-chip RAM: 112,197,632 bits of memory enable large buffers, lookup tables and stateful processing without requiring external memory for many functions.
• Extensive I/O support: 688 I/Os accommodate broad interface needs—parallel buses, multi-lane links and mixed-signal front-ends—on the same FPGA.
• Compact, manufacturable package: 1760-FBGA in a 42.5 × 42.5 mm footprint supports high-density PCB assembly with surface-mount processes.
• Operational robustness: Extended grade temperature range (0 °C to 100 °C) and RoHS compliance support reliable operation and modern manufacturing requirements.
• Built on advanced family technology: The device benefits from Stratix 10 family architectural advances such as the Hyperflex core and 14 nm FinFET process, which are documented for the series.

Why Choose 1SG110HN3F43E3XG?

This Stratix 10 GX FPGA part is positioned for system designs that require very large programmable logic capacity, extensive on-chip RAM and a high total I/O count within a compact BGA package. Its extended temperature range and low-voltage core supply range make it suitable for a wide set of high-performance computing and connectivity applications.

Designers targeting high-bandwidth networking, data-center acceleration, advanced telecom systems or complex test equipment will find the device's mix of logic density, memory and I/O attractive for consolidating functions, reducing external components and scaling performance within a single FPGA footprint.

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