1SG110HN3F43E3VGAS

The 1SG110HN3F43E3VGAS is an Intel Stratix® 10 GX-series FPGA in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package designed for high‑capacity, high‑performance programmable logic applications. This device integrates a large on‑chip logic fabric and memory with high I/O density and is built on the Stratix 10 family architecture described in the device overview.

Targeted at advanced communications, data center, and compute‑intensive designs, the device delivers substantial on‑chip resources and system‑level capabilities for complex implementations where logic density, memory capacity, and I/O count matter.

Key Features

• Logic Capacity  Contains 1,100,000 logic elements, providing large, on‑chip programmable capacity for complex designs.
• On‑Chip Memory  Total RAM bits: 112,197,632, enabling sizable internal buffering, state storage, and memory‑centric algorithms without excessive external memory.
• I/O Density  688 I/Os for high pin‑count interfacing to multi‑lane transceivers, parallel interfaces, and dense system routing.
• Package and Mounting  1760‑BBGA (supplier package 1760‑FBGA, 42.5 × 42.5 mm); surface mount construction for modern PCB assembly flows.
• Power Supply  Core supply range specified at 770 mV to 970 mV to match system power architectures and regulator designs.
• Operating Range and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in controlled‑environment and many commercial applications.
• Stratix 10 Family Innovations  As part of the Stratix 10 GX family, the device leverages the Hyperflex core architecture and Intel 14 nm tri‑gate process innovations described in the device overview to enable higher core performance and efficient implementation of advanced functions.

Typical Applications

• High‑Performance Networking  Dense I/O and large on‑chip memory make the device suitable for packet processing, line cards, and optical/electrical front‑end logic.
• Data Center Acceleration  Substantial logic and memory resources support custom accelerators, offload engines, and data path processing in server and appliance environments.
• Communications Infrastructure  Use in baseband processing, aggregation, and transport equipment where high logic capacity and numerous I/Os are required.
• Test & Measurement  Large on‑chip resources and high I/O count enable complex capture, preprocessing, and protocol handling in instrumentation systems.

Unique Advantages

• High On‑Chip Integration:  1,100,000 logic elements and 112,197,632 bits of RAM let you implement large, complex systems on a single device.
• High I/O Count:  688 I/Os support wide parallel buses, multi‑lane interfaces, and dense board interconnects without additional interface chips.
• Compact, Assembly‑Friendly Package:  1760‑FBGA (42.5 × 42.5 mm) provides a high pin count in a package suited for surface‑mount PCB assembly.
• Designed for Modern Power Domains:  Core voltage range of 770 mV to 970 mV aligns with contemporary low‑voltage regulator solutions.
• Extended Operating Grade:  0 °C to 100 °C operating range accommodates a broad set of commercial and controlled‑environment deployments.
• Backed by Stratix 10 Family Technology:  Built on the Stratix 10 GX family capabilities (including the Hyperflex core architecture and 14 nm process innovations) for high core performance and efficient implementation.

Why Choose 1SG110HN3F43E3VGAS?

The 1SG110HN3F43E3VGAS positions itself as a high‑capacity Stratix 10 GX FPGA option for engineers needing substantial logic, on‑chip memory, and a high count of I/Os in a single, surface‑mount package. Its extended grade and defined voltage and temperature ranges make it suitable for demanding commercial designs that require reliable, repeatable performance.

This device is appropriate for design teams building advanced networking, data center acceleration, communications, and instrumentation solutions that require scalability within the Stratix 10 family and the architectural benefits described in the device overview.

Request a quote or submit an inquiry to get pricing and availability information for the 1SG110HN3F43E3VGAS and to discuss how it fits your next high‑performance FPGA design.