1SG110HN3F43E2LG

The 1SG110HN3F43E2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package optimized for high-performance, bandwidth-intensive designs. As part of the Stratix 10 GX family, this device leverages the family’s Hyperflex core architecture and 14 nm FinFET technology to deliver elevated core performance and power efficiency for advanced networking, compute, and accelerated-processing applications.

Key Features

• Logic Capacity 1,100,000 logic elements for large-scale programmable logic and complex custom architectures.
• Embedded Memory 112,197,632 total RAM bits to support large on-chip buffering, state machines, and memory-intensive algorithms.
• I/O Density 688 I/O pins to support dense system interfaces and high-channel-count connectivity.
• Package and Mounting 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package for high-pin-count, compact board integration.
• Voltage Supply Core supply range of 820 mV to 880 mV to match advanced low-voltage FPGA power domains.
• Operating Temperature Rated for 0 °C to 100 °C operating temperature range and provided in Extended grade.
• Standards & Compliance RoHS compliant for regulatory environmental compatibility.
• Family Innovations (Stratix 10 GX) Device family capabilities include the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process for improved core performance and power characteristics.

Typical Applications

• High‑Performance Networking: Use the device’s high logic capacity and dense I/O to implement packet processing, switching, and line-rate protocol acceleration.
• Data Center & Acceleration: Deploy in compute-acceleration and FPGA-accelerated workloads where large on-chip RAM and extensive logic are required for custom data paths.
• Telecommunications & Backplane Systems: Support high-bandwidth transceiver interfaces and complex framing/forward-error-correction logic in telecom equipment.
• Video & Signal Processing: Apply the on-chip memory and logic resources to implement real-time video processing, transcoding, and multi-channel signal chains.

Unique Advantages

• High Logic Integration: 1,100,000 logic elements enable implementation of large-scale, custom hardware functions without external ASICs.
• Substantial On‑Chip Memory: Over 112 million bits of embedded RAM reduce dependency on external memory for buffering and state storage.
• High I/O Count: 688 I/O pins support complex multi-channel interfaces and dense peripheral connectivity.
• Compact High‑Pin Package: 1760-FBGA (42.5 × 42.5 mm) delivers a high pin count in a single surface-mount package for streamlined PCB designs.
• Power Domain Compatibility: Low-voltage core supply range (820–880 mV) aligns with modern FPGA power architectures to help optimize system power.
• Extended Temperature Grade: Rated 0 °C to 100 °C to meet a wide range of commercial and enterprise operating environments.

Why Choose 1SG110HN3F43E2LG?

This Stratix® 10 GX FPGA combines high-density logic, large on-chip memory, and a high I/O count in a single 1760-FBGA package to address demanding, bandwidth- and compute-intensive system designs. Backed by the Stratix 10 family innovations—such as the Hyperflex core architecture and Intel 14 nm FinFET process—it is positioned for customers building advanced networking, data center, and signal-processing solutions that require scalable programmable logic and robust integration.

Choose this device when your design requires significant on-chip resources, dense external connectivity, and the performance advantages associated with the Stratix 10 GX device family.

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