1SG110HN2F43I2VG

The 1SG110HN2F43I2VG is an Intel Stratix® 10 GX FPGA delivering 1,100,000 logic elements in a 1760-BBGA (FCBGA) package. It targets high-performance, industrial-grade designs that require large logic capacity, substantial embedded RAM, and extensive I/O connectivity.

Built on the Stratix 10 family architecture, this device combines Intel Hyperflex core innovations and advanced process technology with a broad operating range and RoHS compliance, making it suitable for demanding communications, data processing, and compute-acceleration applications.

Key Features

• Logic Capacity  1,100,000 logic elements for complex programmable logic and large-scale design integration.
• Embedded Memory  112,197,632 total RAM bits to support large on-chip buffers, lookup tables, and state storage.
• I/O Density  688 user I/Os enabling wide parallel interfaces, high-pin-count connectivity, and flexible board-level routing.
• Package & Mounting  Surface-mount 1760-BBGA (FCBGA) package, supplier device package 1760-FBGA (42.5 × 42.5 mm), suitable for compact, high-density board designs.
• Operating Range  Industrial-grade operation from −40 °C to 100 °C to meet extended-environment deployment requirements.
• Power Supply  Core voltage range of 770 mV to 970 mV, supporting modern low-voltage FPGA core domains.
• Family Innovations  Based on the Intel Stratix 10 GX family overview, featuring the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process technology for enhanced core performance and efficiency.
• Regulatory Status  RoHS compliant.

Typical Applications

• High‑Performance Networking  Large logic and high I/O count support packet processing, switch fabric control, and custom forwarding engines.
• Data Center Acceleration  Substantial embedded memory and logic enable hardware acceleration for database, search, and compression workloads.
• High‑Speed Communications  Dense I/O and family‑level transceiver/PHY support make this device suitable for backplane and module-level communications designs.
• Signal Processing & DSP  Large logic capacity and on-chip RAM are ideal for multi-channel signal processing, filtering, and real‑time computation tasks.

Unique Advantages

• Massive Programmable Fabric: 1.1M logic elements let you integrate large subsystems on a single device, reducing board-level component count.
• Significant On‑Chip Memory: Over 112Mbits of RAM supports large buffers and stateful processing without external memory dependencies.
• High I/O Count: 688 I/Os provide flexibility for parallel interfaces, multi-lane connectivity, and complex board designs.
• Industrial Temperature Range: −40 °C to 100 °C rating enables deployment in extended-environment industrial systems.
• Advanced Process & Architecture: Stratix 10 family innovations such as the Hyperflex core and 14 nm tri-gate process contribute to strong performance-per-watt characteristics for demanding workloads.
• Compact, High‑Density Package: 1760-ball FCBGA package supports high I/O count in a compact footprint for space-constrained applications.

Why Choose 1SG110HN2F43I2VG?

This Stratix 10 GX device positions itself for designs that require very large programmable logic capacity, extensive on‑chip memory, and high I/O density while operating across an industrial temperature range. Its combination of Stratix 10 family architectural features and a high-ball-count FCBGA package makes it suitable for system-level consolidation of compute and I/O functions.

Designers building high-performance networking, data center acceleration, or advanced signal-processing systems will find this device useful for reducing BOM complexity, supporting large datasets on-chip, and delivering the connectivity needed for multi-lane and parallel interfaces.

If you’d like pricing, availability, or help integrating the 1SG110HN2F43I2VG into your design, request a quote or submit an inquiry and our team will respond with the information you need.