1SG110HN2F43E2VGS1

The 1SG110HN2F43E2VGS1 is a Stratix® 10 GX field programmable gate array (FPGA) from Intel, delivered in a 1760-BBGA FCBGA package. It is a high-capacity FPGA optimized for designs requiring large logic density, significant on-chip memory, and a high I/O count.

As a member of the Stratix 10 GX family, the device leverages the family’s architecture and innovations to address high-performance compute, networking, and signal processing applications while operating within a 0 °C to 100 °C extended temperature range.

Key Features

• Logic Capacity — 1,100,000 logic elements, providing extensive programmable fabric for complex FPGA designs.
• On‑Chip Memory — 112,197,632 total RAM bits to support large buffering, look-up tables, and state storage requirements.
• I/O Density — 688 I/O pins to support wide external interconnect and high-pin-count interfaces.
• Package & Mounting — 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package for high-density board integration.
• Power Supply Range — Core voltage supply range of 770 mV to 970 mV to match system power rails and regulation schemes.
• Operating Grade — Extended grade device specified for 0 °C to 100 °C operation.
• Compliance — RoHS compliant for environmental conformity in modern manufacturing.

Typical Applications

• High‑Performance Computing & Acceleration — Large logic element count and extensive on‑chip RAM enable custom compute kernels and accelerator functions.
• Networking & Telecom — High I/O density supports multi‑lane interfaces and switching fabrics used in networking equipment.
• Signal Processing & Test Equipment — Substantial RAM and logic resources suit real‑time signal processing, FPGA-based instrumentation, and measurement platforms.
• Data Center & Storage — Configurable fabric and memory capacity make the device suitable for offload, protocol processing, and storage controllers.

Unique Advantages

• High logic density: 1,100,000 logic elements enable consolidation of complex functions into a single device, reducing board-level BOM and interconnect complexity.
• Large embedded RAM: 112,197,632 total RAM bits provide substantial on‑chip storage for buffering, queues, and lookup structures, improving system latency and throughput.
• Extensive I/O capability: 688 I/O pins accommodate broad peripheral connectivity and high-bandwidth external interfaces without external multiplexing.
• Industry family innovations: As part of the Stratix 10 GX family, the device benefits from the family’s architecture and features tailored for high-performance applications.
• Compact, high‑density package: 1760‑FBGA (42.5 × 42.5 mm) package provides a compact footprint for systems that require large FPGA capacity in a surface‑mount form factor.
• RoHS compliant and extended temperature: Environmentally compliant with a 0 °C to 100 °C operating range suitable for demanding commercial and industrial environments.

Why Choose 1SG110HN2F43E2VGS1?

This Stratix 10 GX FPGA is positioned for designs that need very large programmable logic capacity, abundant on‑chip memory, and a high number of I/O for complex, high‑bandwidth systems. Its extended temperature rating and RoHS compliance make it appropriate for robust commercial and industrial applications.

Design teams targeting compute acceleration, advanced networking, or real‑time signal processing will find the 1SG110HN2F43E2VGS1 suitable for consolidating functions, reducing external components, and scaling system performance while leveraging the Stratix 10 GX family architecture.

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