1SG110HN2F43E2LG

The 1SG110HN2F43E2LG is an Intel Stratix® 10 GX FPGA in a 1760-BBGA (FCBGA) package, designed for high‑performance, bandwidth‑intensive applications. As part of the Stratix 10 family, this device leverages the Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology to deliver advanced processing capability and power efficiency for demanding system designs.

With 1,100,000 logic elements, extensive on‑chip RAM, and 688 I/O, this FPGA is aimed at applications that require large logic capacity, high I/O density, and integration in a compact surface‑mount package.

Key Features

• Logic Capacity  Provides 1,100,000 logic elements suitable for large, complex designs and high gate‑count implementations.
• On‑Chip Memory  Includes 112,197,632 total RAM bits for buffering, packet processing, and intermediate data storage within the fabric.
• I/O Density  Offers 688 I/O pins to support high channel counts and dense interface requirements.
• Advanced Core Architecture  Built on the Intel Hyperflex core architecture and 14 nm tri‑gate process technology to enable increased core performance and power efficiency across the Stratix 10 family.
• Family Transceiver and IP Innovations  Stratix 10 family features include high‑speed transceivers and hardened IP such as PCI Express and Ethernet interfaces as part of the device family capabilities.
• Package and Mounting  Supplied in a 1760‑BBGA (1760‑FBGA, 42.5 mm × 42.5 mm) surface‑mount package for dense board integration.
• Power Supply  Core supply range specified from 820 mV to 880 mV to match platform power design requirements.
• Operating Range  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Regulatory  RoHS‑compliant for lead‑free manufacturing and environmental conformance.

Typical Applications

• High‑Speed Networking  Used for packet processing, switching, and linecard functions where high logic capacity and large on‑chip memory accelerate throughput and buffering.
• Data Center Acceleration  Suitable for compute offload and acceleration tasks that require dense logic, ample RAM, and substantial I/O connectivity in a compact package.
• Telecommunications and Backplane Systems  Deployable in bandwidth‑intensive telecom equipment leveraging the Stratix 10 family’s high‑performance transceiver and IP capabilities.
• Signal Processing and DSP  Appropriate for advanced signal processing workloads that benefit from large logic resources and embedded memory for streaming data and algorithmic operations.

Unique Advantages

• Large Logic Resource: 1,100,000 logic elements enable implementation of complex algorithms and large‑scale designs without external logic partitioning.
• Substantial On‑Chip RAM: 112,197,632 bits of RAM reduce reliance on external memory for intermediate storage, lowering system latency and simplifying board design.
• High I/O Count: 688 I/O pins support dense interfacing to multiple peripherals, transceivers, and memory buses on a single device.
• Family‑Level Performance Innovations: Leveraging the Stratix 10 Hyperflex architecture and 14 nm process provides higher core performance and power efficiency compared to previous generations.
• Compact Surface‑Mount Package: The 1760‑FBGA (42.5 × 42.5 mm) package enables integration into space‑constrained boards while maintaining high pin count.
• Extended Temperature Grade: Rated for 0 °C to 100 °C operation to support a wide range of commercial and enterprise environments.

Why Choose 1SG110HN2F43E2LG?

The 1SG110HN2F43E2LG positions itself as a high‑capacity Stratix 10 GX FPGA offering a blend of large logic resources, extensive on‑chip RAM, and high I/O density in a single surface‑mount package. It is well suited to engineers designing high‑bandwidth, compute‑intensive systems where consolidation of logic and memory on one device simplifies board architecture and improves performance.

Choosing this part provides scalability within the Stratix 10 family and access to family‑level innovations such as the Hyperflex core architecture and advanced transceiver/IP options, delivering long‑term value for demanding communications, data center, and signal processing designs.

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