1SG110HN2F43E1VG

The 1SG110HN2F43E1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) device supplied in a 1760‑BBGA (FCBGA) package. It delivers high logic capacity and on‑chip memory suitable for compute‑ and bandwidth‑intensive designs.

Built on the Stratix 10 family architecture, the device targets advanced applications requiring large programmable fabric, abundant on‑chip RAM, and high I/O density while operating within a 770 mV–970 mV supply range and an extended temperature grade (0 °C to 100 °C).

Key Features

• Logic Capacity — 1,100,000 logic elements (logic cells) enabling complex digital designs and large custom accelerators.
• On‑chip Memory — 112,197,632 total RAM bits for large packet buffers, FIFOs, and state storage directly in the FPGA fabric.
• I/O Density — 688 I/O pins to support high‑pin‑count interfacing and multiple parallel buses or channels.
• Package & Mounting — 1760‑BBGA (FCBGA) supplier device package 1760‑FBGA (42.5 × 42.5 mm); surface mount for standard board assembly processes.
• Power Supply — Core supply range from 770 mV to 970 mV, enabling integration with modern low‑voltage power architectures.
• Operating Temperature & Grade — Extended grade with an operating range of 0 °C to 100 °C suitable for a wide range of commercial and industrial environments that match the specified grade.
• RoHS Compliance — Device is RoHS compliant.
• Family Innovations (Series‑level) — Stratix 10 GX series features the Intel Hyperflex™ core architecture and Intel 14 nm FinFET technology, delivering doubled core performance versus previous high‑performance generations (family specification).

Typical Applications

• High‑Performance Networking — Use the large logic capacity and abundant on‑chip RAM to implement packet processing, switching, and custom protocol offloads.
• Data Center Acceleration — Deploy FPGA‑based accelerators that require dense logic and memory resources for compute kernels and buffering.
• Telecommunications Equipment — High I/O count and family transceiver capabilities (series‑level) support multi‑channel interfaces and backplane connectivity.
• Signal Processing — Implement large DSP pipelines and dataflow architectures using the device’s logic resources and internal RAM.

Unique Advantages

• High Density Logic: 1,100,000 logic elements allow implementation of large, complex designs without immediate partitioning across devices.
• Substantial On‑Chip RAM: 112,197,632 total RAM bits reduce dependence on external memory for many buffering and stateful functions.
• Robust I/O Count: 688 I/Os provide flexibility to interface with multiple high‑speed lanes, peripherals, and parallel buses.
• Compact, High‑Pin Package: 1760‑BBGA FCBGA package (1760‑FBGA supplier designation, 42.5 × 42.5 mm) supports dense PCB routing and high interconnectivity in a single device.
• Designed for Modern Power Domains: Core voltage range of 770 mV–970 mV aligns with contemporary low‑voltage power architectures used in advanced systems.
• Extended Temperature Grade: Rated 0 °C to 100 °C to meet the thermal needs of many commercial and industrial deployments that require extended‑range operation.

Why Choose 1SG110HN2F43E1VG?

The 1SG110HN2F43E1VG positions itself as a high‑capacity Stratix 10 GX FPGA option for designers who need substantial logic density, abundant on‑chip RAM, and a high I/O count in a compact FCBGA package. Its supply voltage window and extended temperature grade make it suitable for demanding compute and networking applications that require reliable operation within the specified environmental and power ranges.

Choosing this device provides a path to leverage the Stratix 10 family’s architectural innovations while integrating a single, high‑density FPGA into systems that demand large programmable resources, plentiful RAM, and extensive interfacing capability.

Request a quote or submit an inquiry to receive pricing and availability information for the 1SG110HN2F43E1VG Stratix® 10 GX FPGA.