1SG110HN1F43I2VG

The 1SG110HN1F43I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It provides 1,100,000 logic elements, 112,197,632 bits of embedded RAM and 688 I/Os to address high-density, high-throughput FPGA designs. Built on the Stratix 10 family architecture, this device targets advanced applications requiring large logic capacity, extensive I/O, and industrial-grade operating range.

Key Features

• Logic Capacity  1,100,000 logic elements (cells) enabling large, complex designs and high integration of programmable logic.
• Embedded Memory  112,197,632 total RAM bits for on-chip buffering, lookup tables and storage close to logic.
• I/O Density  688 I/Os to support wide parallel interfaces, multiple high-speed links, and dense connectivity requirements.
• Power and Core Voltage  Core voltage supply range from 770 mV to 970 mV, matching low-voltage core domains used in modern FPGA fabrics.
• Package & Mounting  1760-BBGA / 1760-FBGA supplier package (42.5 × 42.5 mm) in a surface-mount form factor for high-density board integration.
• Operating Temperature  Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant, supporting regulatory and manufacturing requirements.
• Stratix 10 Family Architecture  Based on Intel Stratix 10 GX/SX device technologies and Intel Hyperflex core architecture (family-level details from the Stratix 10 overview).

Typical Applications

• High-density networking and telecom equipment  Use the device’s large logic and I/O counts to implement packet processing, protocol engines, and multi-lane interfaces.
• Data center and acceleration  On-chip memory and extensive logic capacity support custom accelerators, buffering and data-path implementations.
• Advanced test & measurement  High I/O density and large embedded RAM enable complex signal processing and real-time capture/playback designs.
• Embedded compute and processing  Stratix 10 family architectural features support designs that combine dense logic with demanding compute tasks.

Unique Advantages

• Massive programmable fabric: 1,100,000 logic elements provide headroom for highly integrated designs and multi-function systems on a single device.
• Large on-chip RAM: 112,197,632 bits of embedded RAM reduce external memory bandwidth needs and simplify data-path architectures.
• High I/O count: 688 I/Os enable broad peripheral connectivity, parallel data lanes and flexible interface mapping.
• Industrial operating range: Specified from −40 °C to 100 °C for deployment in demanding temperature environments.
• Compact, production-ready package: 1760-FBGA (42.5 × 42.5 mm) surface-mount package supports high-density PCB layouts and automated assembly.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements for commercial production.

Why Choose 1SG110HN1F43I2VG?

The 1SG110HN1F43I2VG positions itself where large programmable capacity, extensive I/O and substantial on-chip RAM are required in an industrial-grade FPGA. With 1,100,000 logic elements, over 112 million bits of embedded RAM and 688 I/Os in a 1760-FBGA surface-mount package, it is suited to designs that consolidate multiple functions into a single, high-density device.

Backed by the Intel Stratix 10 family architecture, this device provides a platform that aligns architecture-level innovations with practical board-level features such as a low-voltage core domain and wide operating temperature range, delivering a balance of integration, scalability and production readiness.

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