1SG110HN1F43I2VGAS

The 1SG110HN1F43I2VGAS is a Stratix® 10 GX FPGA device delivering high logic capacity and extensive I/O for demanding, bandwidth‑intensive designs. It leverages the Stratix 10 family architecture, including the Intel Hyperflex core innovations and 14 nm tri‑gate (FinFET) process described for the family, to address advanced applications that require large programmable fabric and high‑speed interfaces.

This device is specified for industrial operation and integrates a high count of logic elements and on‑chip RAM to support complex logic, memory‑intensive processing, and high‑throughput data movement in systems that require robust thermal and voltage operating ranges.

Key Features

• Logic Capacity  1,100,000 logic elements provide substantial programmable fabric for large designs and complex algorithms.
• On‑Chip Memory  112,197,632 total RAM bits available for buffering, packet processing, and memory‑based algorithms; the Stratix 10 family also uses M20K internal SRAM blocks as a memory building block.
• I/O and High‑Speed Interfaces  688 I/O pins support extensive connectivity; Stratix 10 family transceiver technology supports high data‑rate serial links and heterogeneous 3D SiP transceiver tiles with family‑level data rates up to 28.3 Gbps.
• Core Architecture  Built on the Intel Hyperflex core architecture and 14 nm tri‑gate (FinFET) process as described for the Stratix 10 family, delivering improved core performance and power characteristics at the family level.
• Package and Mounting  1760‑BBGA (FCBGA) surface‑mount package, supplier package size 1760‑FBGA (42.5 × 42.5 mm) for dense system integration.
• Power and Voltage  Core voltage supply range 770 mV to 970 mV to match system power rails and enable core voltage scaling.
• Thermal and Environmental  Industrial operating temperature range of −40 °C to 100 °C and RoHS compliant.
• Family‑Level System IP  Stratix 10 family features include hard IP options such as PCI Express Gen3 and high‑speed Ethernet/FEC, fractional PLLs, and advanced DSP blocks (family documentation).

Typical Applications

• High‑Speed Networking and Telecom: Implement packet processing, backplane interfaces, and line‑card functions using the device's extensive I/O and high‑speed transceiver capability described for the family.
• Data Center Acceleration: Use large logic capacity and substantial on‑chip RAM for FPGA‑based acceleration, PCIe endpoint/host functions, and custom offload engines.
• Signal Processing and Imaging: Deploy complex DSP and algorithm pipelines that benefit from high logic density and large embedded memory.
• Test, Measurement and Broadcast: Support high‑bandwidth data capture, aggregation, and protocol conversion using dense programmability and wide I/O resources.

Unique Advantages

• High Logic Density: 1,100,000 logic elements enable implementation of large, integrated systems on a single FPGA.
• Significant On‑Chip Memory: 112,197,632 RAM bits reduce dependence on external memory for many buffering and state‑storage needs.
• Extensive I/O and High‑Speed Links: 688 I/O pins combined with family transceiver technology allow complex multi‑lane interfaces and high‑throughput system designs.
• Industrial Temperature Rating: Specified −40 °C to 100 °C to meet demanding thermal environments and industrial deployment needs.
• Scalable Family Architecture: Leverages Stratix 10 family innovations such as Hyperflex cores and advanced PLL/transceiver features to simplify migration and scaling across family variants.
• Compact, Surface‑Mount Package: 1760‑BBGA (42.5 × 42.5 mm) package supports high‑density board designs while providing robust electrical and thermal characteristics.

Why Choose 1SG110HN1F43I2VGAS?

The 1SG110HN1F43I2VGAS positions itself for designs that require very large programmable fabric, substantial on‑chip memory, and broad I/O connectivity in an industrial‑rated device. Its combination of 1,100,000 logic elements, 112,197,632 RAM bits, and 688 I/O pins provides the resources needed for complex, high‑throughput systems.

Choosing this Stratix 10 GX device lets teams leverage the family‑level architectural innovations—such as the Intel Hyperflex core approach, advanced transceiver and PLL capabilities, and hard IP options—while maintaining a compact surface‑mount footprint and industrial operating range for reliable deployment.

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