1SG110HN2F43E2LGAS

The 1SG110HN2F43E2LGAS is an Intel Stratix 10 GX FPGA packaged in a 1760‑FBGA (42.5 × 42.5 mm) surface‑mount package. It provides a high‑capacity programmable fabric with 1,100,000 logic elements and 112,197,632 total RAM bits, delivering the resources needed for compute‑ and bandwidth‑intensive designs.

Targeted at advanced networking, compute acceleration and high‑performance embedded applications, this device pairs large logic and memory resources with 688 I/O pins, an extended grade operating range, and low core voltage operation for tightly integrated system designs.

Key Features

• Core architecture  Based on the Stratix 10 GX family architecture described in the device overview, including Intel Hyperflex core innovations referenced in the datasheet.
• Logic capacity  1,100,000 logic elements to implement large custom hardware functions and complex datapaths.
• On‑chip memory  112,197,632 total RAM bits of embedded memory for buffering, packet processing, and on‑chip storage.
• High pin‑count I/O  688 I/O pins to support wide parallel interfaces, high‑speed transceiver connections, and dense board routing.
• Package and mounting  1760‑BBGA (FCBGA) supplier package, 1760‑FBGA (42.5 × 42.5 mm) form factor; surface‑mount for standard assembly processes.
• Power rails  Core supply range specified at 820 mV to 880 mV, enabling precise power budgeting in system design.
• Operating temperature  Extended grade operation from 0 °C to 100 °C for use in a wide range of environmental conditions.
• Regulatory status  RoHS compliant.

Typical Applications

• Data center acceleration  Large logic capacity and abundant on‑chip RAM make the device suitable for hardware accelerators, packet processing, and protocol offload functions.
• High‑bandwidth networking  High I/O count supports multi‑lane, high‑throughput interfaces and dense external connectivity for switches, routers, and line cards.
• Compute and signal processing  Substantial logic and memory resources enable complex DSP, encryption, and real‑time processing pipelines.
• Advanced embedded systems  Extended temperature grade and surface‑mount package allow integration into demanding embedded platforms requiring large programmable fabric.

Unique Advantages

• High logic and memory density: 1,100,000 logic elements and 112,197,632 RAM bits provide the headroom to implement large, integrated hardware subsystems on a single device.
• Extensive I/O capability: 688 I/O pins give designers flexibility to interface with multiple high‑speed peripherals and wide external buses without external multiplexing.
• Compact high‑pin FCBGA package: 1760‑FBGA (42.5 × 42.5 mm) packaging delivers high integration density while supporting standard surface‑mount assembly.
• Power‑budget friendly core rail: Defined core voltage range (820 mV–880 mV) aids precise power planning and thermal design for large FPGA deployments.
• Extended grade operation: Rated 0 °C to 100 °C to accommodate a broad set of system environments where extended ambient ranges are required.
• RoHS compliance: Aligns with regulatory requirements for lead‑free manufacturing and global environmental standards.

Why Choose 1SG110HN2F43E2LGAS?

This Stratix 10 GX FPGA part combines very large programmable logic capacity and substantial on‑chip memory with a high I/O count and a compact 1760‑FBGA package. It is well suited for designs that require significant hardware acceleration, complex datapaths, and dense external interfacing within an extended operating temperature range.

For teams building high‑performance networking, acceleration, or embedded compute platforms, the 1SG110HN2F43E2LGAS delivers the scale and integration to consolidate functions onto a single device while maintaining precise control over power and thermal parameters.

Request a quote or submit a pricing inquiry to begin evaluating the 1SG110HN2F43E2LGAS for your next high‑performance FPGA design.