1SG110HN2F43E2VGAS

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1100000 1760-BBGA, FCBGA

Quantity 461 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs137500Number of Logic Elements/Cells1100000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits112197632

Overview of 1SG110HN2F43E2VGAS – Stratix® 10 GX FPGA, 1,100,000 logic elements, 1760-BBGA

The 1SG110HN2F43E2VGAS is a Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760-BBGA FCBGA package designed for high-performance, bandwidth‑intensive systems. This device pairs a large programmable fabric—1,100,000 logic elements—with extensive on‑chip memory and rich I/O to address advanced networking, compute acceleration, and high-speed protocol applications.

As part of the Stratix 10 GX family, the device leverages family-level innovations such as the Intel Hyperflex core architecture and 14 nm FinFET process to deliver the performance and integration expected for demanding system designs.

Key Features

  • Logic Capacity — 1,100,000 logic elements providing large-scale programmable fabric for complex custom logic and system integration.
  • On‑Chip Memory — 112,197,632 total RAM bits to support large buffers, packet processing, and embedded data structures without immediate dependence on external memory.
  • I/O Density — 688 device I/O pins to support extensive interfacing, multi-protocol front-ends, and high-pin-count board designs.
  • Power Supply Range — Operates from 770 mV to 970 mV, enabling designs that match platform power management strategies.
  • Package and Mounting — 1760-BBGA (FCBGA) surface-mount package; supplier package listed as 1760-FBGA with 42.5 × 42.5 mm footprint for compact, high-pin-count board layouts.
  • Operating Temperature — 0 °C to 100 °C grade (Extended) suitable for thermally demanding commercial and enterprise applications.
  • Family-Level Architecture — Benefits from Stratix 10 GX innovations including the Intel Hyperflex core architecture, heterogeneous 3D SiP transceiver tiles, and high-performance transceiver and DSP capabilities (family-level features).
  • Regulatory — RoHS compliant.

Typical Applications

  • Data Center Networking — High logic density and large on‑chip RAM support packet processing, switch fabric acceleration, and protocol offload functions.
  • Telecommunications and Backplane Systems — Extensive I/O and family-level high-speed transceiver features enable implementation of backplane protocols and line cards.
  • Compute Acceleration — Large programmable fabric and internal memory facilitate custom acceleration engines and variable‑precision DSP workloads.
  • High‑Speed I/O Bridging — The device’s pin count and family-level transceiver/PCIe support are suited to bridging and protocol gateway applications in enterprise equipment.

Unique Advantages

  • High Programmable Capacity: 1,100,000 logic elements allow implementation of large, integrated system functions on a single device, reducing board-level complexity.
  • Significant On‑Chip Memory: Over 112 million bits of RAM reduce dependence on external memory for buffering and state storage, improving performance and latency.
  • Broad I/O Footprint: 688 I/O pins support complex multi-interface systems and dense mezzanine or card edge connections.
  • Compact, High‑Pin Package: 1760‑BBGA FCBGA with a 42.5 × 42.5 mm supplier footprint balances high pin count with manageable PCB area for system-level density.
  • Designed for Performance Families: As a Stratix 10 GX family device, it benefits from architectural advances such as the Hyperflex core and 14 nm FinFET technology to meet demanding processing and bandwidth requirements.
  • Extended Temperature Grade: Rated 0 °C to 100 °C, enabling deployment in thermally challenging commercial environments.

Why Choose 1SG110HN2F43E2VGAS?

This Stratix 10 GX device positions itself as a high-capacity, high‑integration FPGA for engineers building bandwidth‑ and compute‑intensive systems. With 1,100,000 logic elements, substantial internal RAM, and 688 I/Os in a compact 1760‑BBGA package, it supports consolidation of multiple system functions onto a single FPGA, reducing BOM and board complexity.

Choose this part for designs that require scalable programmable resources, extensive on-chip storage, and a large I/O matrix, backed by the Stratix 10 GX family architecture and RoHS compliance for enterprise and commercial applications.

Request a quote or submit your design requirements to receive pricing and availability for 1SG110HN2F43E2VGAS. Our team will assist with lead times and technical options to help integrate this Stratix 10 GX FPGA into your next design.

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