1SG110HN2F43I2LGAS

The 1SG110HN2F43I2LGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1760-BBGA (FCBGA) package. It provides a high-capacity programmable fabric tailored for advanced digital designs requiring large logic capacity, substantial on-chip memory, and dense I/O.

Targeted at industrial applications, this device combines 1,100,000 logic elements with 112,197,632 bits of on-chip RAM and 688 I/O pins, delivering the integration needed for high-bandwidth communications, compute acceleration, and complex system integration while meeting industrial temperature and RoHS requirements.

Key Features

• Core Architecture  Intel Stratix 10 family architecture (Hyperflex core architecture referenced in family documentation) designed for high-performance FPGA implementations.
• Logic Capacity  1,100,000 logic elements providing large-scale programmable logic for complex designs and high gate-count implementations.
• On-Chip Memory  112,197,632 total RAM bits to support large buffering, lookup tables, and data-path storage without external memory dependence.
• I/O Density & Package  688 I/O pins in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm supplier package) surface-mount package for dense board-level connectivity and system integration.
• Power Supply  Core voltage supply range of 820 mV to 880 mV, suitable for regulated, low-voltage FPGA core domains.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, supporting industrial deployment environments.
• Mounting & Compliance  Surface mount device with RoHS compliance for modern manufacturing and environmental standards.

Typical Applications

• High-bandwidth Networking  System-level implementations requiring dense logic and large on-chip RAM for packet processing, protocol offload, and high-speed I/O.
• Compute Acceleration  Hardware acceleration for signal processing and algorithmic workloads that benefit from large logic capacity and embedded memory.
• Telecommunications & Backplane Systems  Designs leveraging many I/Os and a high-pin-count package for modular, high-throughput communications equipment.
• Industrial Control & Automation  Industrial systems that require extended temperature range, high integration, and deterministic programmable logic.

Unique Advantages

• High logic density: 1,100,000 logic elements enable consolidation of complex functions and reduce board-level component count.
• Substantial embedded memory: 112,197,632 bits of on-chip RAM simplify buffering and state storage, lowering dependence on external memories.
• Extensive I/O in a compact package: 688 I/Os in a 1760-BBGA provide broad connectivity while keeping a manageable PCB footprint.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Low-voltage core operation: 820–880 mV supply range aligns with modern low-voltage power architectures for power-efficient core domains.
• RoHS compliant: Conforms to environmental manufacturing requirements for global electronics production.

Why Choose 1SG110HN2F43I2LGAS?

This Stratix® 10 GX device is positioned for designs that require very large programmable logic capacity, significant on-chip RAM, and broad I/O connectivity while meeting industrial temperature and environmental standards. Its combination of 1,100,000 logic elements, over 112 Mbits of RAM, and 688 I/Os in a 1760-BBGA package makes it suitable for system-level consolidation in networking, compute acceleration, and industrial systems.

Designed within the Stratix 10 family architecture, the device offers the scalability and ecosystem advantages associated with Intel’s high-performance FPGA portfolio, providing a clear upgrade path for projects that need high integration, robust operation, and long-term availability.

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