1SG110HN2F43I2LG

The 1SG110HN2F43I2LG is an Intel Stratix® 10 GX field programmable gate array packaged in a 1760-FBGA (42.5×42.5 mm) surface-mount package. It combines Intel's Hyperflex core architecture with a high logic and memory capacity to address high-bandwidth, compute-intensive FPGA designs.

Targeted at industrial applications, this device offers 1,100,000 logic elements, 112,197,632 total RAM bits and 688 I/O pins while operating across an industrial temperature range and a low core voltage supply.

Key Features

• Core & Architecture  Built on the Intel Hyperflex core architecture (family-level feature) to enable high core performance for complex logic and compute tasks.
• Logic Capacity  1,100,000 logic elements, supporting large-scale FPGA implementations and dense custom logic integration.
• On-chip Memory  112,197,632 total RAM bits of internal memory for sizable data buffering, state storage, and high-throughput algorithms.
• I/O Density  688 I/O pins to support wide parallel interfaces, multi-lane transceivers and extensive peripheral connectivity.
• Package & Mounting  1760-BBGA / 1760-FBGA package (42.5×42.5 mm) with surface-mount mounting type for compact board integration.
• Power Supply  Core voltage range of 820 mV to 880 mV to support the device's specified operating conditions.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C suitable for industrial environment deployments.
• Device Grade & Compliance  Industrial grade device; RoHS compliant.

Typical Applications

• High-bandwidth Networking  Dense logic and large on-chip memory support packet processing, protocol offload and accelerated networking functions.
• Data Center Acceleration  High logic element count and extensive I/O make the device suitable for hardware acceleration tasks and custom data-path implementations.
• Signal Processing & Communications  Large RAM capacity and broad I/O enable real-time signal processing, multi-channel aggregation and protocol bridging.
• Industrial Systems  Industrial-grade temperature range and high I/O count support control, monitoring and interface consolidation in industrial equipment.

Unique Advantages

• High integration density: 1,100,000 logic elements and 112,197,632 RAM bits reduce the need for external logic and memory, simplifying system BOMs.
• Extensive I/O capability: 688 I/O pins enable broad peripheral connectivity and multi-lane interface designs without external multiplexing.
• Industrial-ready thermal range: Rated −40 °C to 100 °C to support deployments in demanding environmental conditions.
• Compact FBGA package: 1760-FBGA (42.5×42.5 mm) provides a balance of high pin count and board-space efficiency for dense PCB layouts.
• Low core-voltage operation: 820–880 mV supply range supports the device's optimized power domain requirements for system-level power planning.
• RoHS compliant: Conforms to RoHS requirements for regulatory and manufacturing consistency.

Why Choose 1SG110HN2F43I2LG?

The 1SG110HN2F43I2LG positions itself as a high-capacity, industrial-grade Stratix® 10 GX FPGA suited for designs that require substantial logic, memory and I/O resources in a single device. Its combination of 1,100,000 logic elements, over 112 million bits of on-chip RAM and 688 I/Os supports large, integrated FPGA implementations while the 1760-FBGA package simplifies board-level integration.

Choose this device for systems that demand scalable logic capacity, broad interface options and industrial temperature operation, backed by Intel Stratix 10 family architecture and device-level specifications for long-term platform continuity.

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