1SG110HN2F43I2VGAS

The 1SG110HN2F43I2VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1760-BBGA FCBGA package. It pairs a high-density programmable fabric with family-level innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process to address high-bandwidth, high-performance designs.

Targeted at demanding applications that require extensive logic, embedded memory and large I/O counts, this industrial-grade device delivers a combination of integration, transceiver capability and power-optimized core operation for advanced communications, compute and signal-processing systems.

Key Features

• Logic Fabric — 1,100,000 logic elements providing substantial programmable capacity for complex custom logic, routing and compute pipelines.
• Embedded Memory — 112,197,632 total RAM bits of on-chip SRAM to support large buffering, packet processing and on-chip data storage.
• I/O Density — 688 general-purpose I/O pins to connect multiple interfaces, high-speed PHYs and wide parallel buses.
• Transceiver and Family Innovations — Stratix 10 family features such as the Hyperflex core architecture and heterogeneous 3D SiP transceiver tiles, with family-level transceiver performance and hard IP for high-speed serial protocols.
• Compute and DSP — Family-level variable precision DSP blocks and architecture optimizations designed for high-throughput signal processing and numeric acceleration.
• Power and Clocking — Core voltage supply range 770 mV to 970 mV and family-referenced fractional synthesis PLLs and clocking features to support low-voltage, high-performance operation.
• Package and Mounting — 1760-BBGA (FCBGA) surface-mount package, supplier device package 1760-FBGA (42.5 × 42.5 mm) for compact board-level integration.
• Operating Environment — Industrial-grade device with an operating temperature range of −40°C to 100°C and RoHS compliance for environmental standards.

Typical Applications

• High-Speed Networking — Use the device’s extensive I/O and family transceiver capabilities for line-rate packet processing, switching fabrics and backplane interfaces.
• Data Center Acceleration — Leverage large logic and on-chip memory to implement custom acceleration engines, protocol offloads and data-plane functions.
• Signal Processing and Communications — Deploy the FPGA’s DSP resources and embedded RAM for high-throughput modulation, channel coding and baseband processing tasks.
• Embedded System Integration — Integrate programmable logic with hard IP blocks and high I/O counts for system control, bridging and protocol translation in complex embedded applications.

Unique Advantages

• High Logic Density: 1,100,000 logic elements enable large-scale custom logic implementations without external ASICs.
• Substantial On-Chip Memory: 112,197,632 total RAM bits reduce dependence on external memory for packet buffering and data staging.
• Extensive I/O: 688 I/O pins provide flexible connectivity for multi-lane interfaces, parallel buses and peripheral integration.
• Industrial Temperature Range: −40°C to 100°C rating supports deployment in demanding environmental conditions.
• Compact, Surface-Mount Packaging: 1760-BBGA (42.5 × 42.5 mm) provides a high-pin-count footprint suitable for dense system boards.
• Family-Level Architectural Benefits: Intel Hyperflex core architecture and 14 nm FinFET process, as described for the Stratix 10 family, deliver the performance and integration advantages designed into this device family.

Why Choose 1SG110HN2F43I2VGAS?

This Stratix 10 GX FPGA part combines high logic capacity, large on-chip memory and a high I/O count in an industrial-grade, surface-mount 1760-BBGA package. It is well suited for engineers building high-performance networking, compute acceleration and signal-processing systems that require dense programmable resources and robust thermal and voltage operating windows.

Choosing this device provides access to the Stratix 10 family’s architectural innovations—such as the Hyperflex core and high-speed transceiver technology—while delivering the specific, verifiable hardware characteristics required for complex, production-grade designs.

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