1SG110HN3F43E2VG

The 1SG110HN3F43E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA (FCBGA) package. It combines a high-density programmable fabric with architecture-level innovations from the Stratix 10 family to address demanding bandwidth and processing applications.

Designed for high-performance systems, this device delivers 1,100,000 logic elements, abundant on-chip RAM, and a large I/O count for complex interface and acceleration tasks while operating within a low-voltage core range and an extended temperature grade.

Key Features

• Core Architecture  Built on the Intel Stratix 10 family architecture, featuring the Hyperflex core innovations described in the device overview for improved core performance.
• Logic Density  1,100,000 logic elements, providing the capacity for large-scale programmable logic and complex designs.
• On-chip Memory  112,197,632 total RAM bits to support large buffering, caching, and memory-intensive functions in the FPGA fabric.
• I/O Resources  688 user I/Os for wide peripheral connectivity and multi-protocol interfacing.
• Power and Voltage  Core voltage supply range of 770 mV to 970 mV to match platform power requirements and enable optimized power delivery.
• Package  1760-BBGA (FCBGA) package; supplier device package listed as 1760-FBGA (42.5 × 42.5 mm) for board-level planning and mechanical integration.
• Temperature Grade  Extended grade with an operating range of 0 °C to 100 °C for deployment in a variety of commercial and enterprise environments.
• Compliance  RoHS compliant to support regulatory requirements for lead-free assemblies.

Typical Applications

• High-performance networking  Implement packet processing, protocol engines, and acceleration functions leveraging high logic density and large I/O counts.
• Data center acceleration  Offload compute kernels and implement custom data-paths using the device’s large on-chip RAM and dense programmable fabric.
• Telecommunications and backplane systems  Support high-throughput links and complex interface logic where extensive I/Os and memory are required.
• Custom compute and signal processing  Deploy variable-precision DSP and large logic networks for application-specific acceleration and signal processing workloads.

Unique Advantages

• High logic capacity: 1,100,000 logic elements enable large, complex designs without immediate partitioning across multiple devices.
• Substantial on-chip memory: 112,197,632 bits of RAM reduce external memory dependence and improve throughput for memory-bound tasks.
• Extensive I/O: 688 I/Os provide flexibility to support multiple high-bandwidth interfaces and mixed-signal front ends.
• Compact, industry-standard package: 1760-BBGA (42.5 × 42.5 mm) supports dense board layouts and standardized thermal/mechanical planning.
• Low-voltage core operation: 770–970 mV supply range enables efficient power delivery and platform-level power optimization.
• Extended operating range: 0 °C to 100 °C qualification fits many commercial and enterprise deployment scenarios.

Why Choose 1SG110HN3F43E2VG?

This Stratix® 10 GX FPGA part combines family-level architecture innovations with device-level scale to support demanding processing and interface requirements. Its mix of 1.1M logic elements, large embedded RAM, and substantial I/O count makes it suitable for designs that require both logic capacity and memory bandwidth within a single device.

Engineers and system designers seeking scalable FPGA resources for networking, acceleration, and telecommunications applications will find the 1SG110HN3F43E2VG suitable for complex, performance-oriented designs while benefiting from the Stratix 10 family feature set and RoHS compliance for streamlined production.

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