1SG110HN3F43E3VGS1
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1100000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 653 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 137500 | Number of Logic Elements/Cells | 1100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 112197632 |
Overview of 1SG110HN3F43E3VGS1 – Stratix® 10 GX FPGA, 1,100,000 logic elements, 688 I/Os, 1760-FBGA
The 1SG110HN3F43E3VGS1 is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-FBGA (42.5 × 42.5 mm) package. It implements the Intel Hyperflex™ core architecture and series-level innovations designed for high-bandwidth, high-performance programmable logic and system integration.
Targeted at advanced communications, data center, and compute-accelerated designs, this device delivers a large logic capacity and extensive on-chip memory with flexible I/O to support complex system-level implementations.
Key Features
- Logic Capacity 1,100,000 logic elements provide large-scale programmable fabric for complex algorithms and custom accelerators.
- On-chip Memory 112,197,632 total RAM bits of internal memory to support deep buffering, packet processing, and large state machines.
- I/O Density 688 I/Os enable extensive external connectivity for high-pin-count interfaces and multi-lane link implementations.
- Power Supply Core voltage supply range of 770 mV to 970 mV to match target power domains and system power-rail design.
- Package & Mounting 1760-FBGA (42.5 × 42.5 mm) package, surface-mount mounting type, suitable for high-density board designs.
- Operating Range & Grade Extended grade with an operating temperature range of 0 °C to 100 °C for elevated-temperature system environments.
- Series-Level Architecture Built on Intel Hyperflex core architecture and 14 nm FinFET technology (series-level), offering the performance and architectural features described in the Stratix 10 GX/SX family documentation.
- High-Speed Protocol IP (Series-Level) Stratix 10 GX/SX series documentation references hard IP for PCI Express Gen3, 10G Ethernet, and advanced transceiver features and PLLs, which are part of the device family capabilities.
- RoHS Compliant Device meets RoHS environmental compliance requirements.
Typical Applications
- High‑Performance Networking Use the device's large logic capacity, abundant I/O, and series-level transceiver and Ethernet IP to implement packet processing, switching, and line-card functions.
- Data Center Acceleration Deploy as an application accelerator where large on-chip RAM and extensive logic elements are required for custom compute kernels and buffering.
- Telecommunications Systems Implement multi-protocol PHYs, forward error correction, and complex framing logic leveraging the family’s high-speed transceiver features and large fabric.
- Advanced Embedded Systems Integrate high-density I/O and substantial memory resources for signal processing, protocol bridging, and system control in demanding embedded applications.
Unique Advantages
- Very large programmable fabric: 1,100,000 logic elements enable consolidation of multiple functions into a single device.
- Extensive on-chip memory: 112,197,632 RAM bits reduce dependence on external memory for buffering and state storage.
- High I/O count: 688 I/Os provide flexibility to interface with numerous peripherals and high-speed front-end links.
- Robust package for dense designs: 1760-FBGA (42.5 × 42.5 mm) supports high routing density in compact layouts.
- Extended temperature grade: Rated 0 °C to 100 °C to suit systems that operate above standard commercial temperatures.
- Series-level performance innovations: Intel Hyperflex architecture and 14 nm FinFET technology (as described for the Stratix 10 family) bring enhanced core performance and power characteristics to the device family.
Why Choose 1SG110HN3F43E3VGS1?
The 1SG110HN3F43E3VGS1 combines a very large logic element count, substantial on-chip RAM, and high I/O density in a single 1760-FBGA package, making it suitable for system designs that require significant programmable resources and dense external connectivity. Its extended temperature grade and RoHS compliance align with reliability and environmental considerations for demanding applications.
This part is well suited to teams designing high-bandwidth networking, data center acceleration, and advanced embedded systems that need scalable logic capacity, large internal memory, and comprehensive I/O in a single FPGA solution from the Stratix 10 GX family.
Request a quote or submit an inquiry to receive pricing and availability for the 1SG110HN3F43E3VGS1. Our team can provide lead-time information and help evaluate this device for your design requirements.

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