1SG110HN3F43I1VG

The 1SG110HN3F43I1VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) supplied in a 1760-BBGA (FCBGA) package. It delivers a high-density programmable fabric with 1,100,000 logic elements and extensive I/O capability for demanding, bandwidth‑centric designs.

Built on Stratix 10 family innovations — including the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) technology — this device targets high-performance applications where large logic capacity, on-chip RAM, and robust I/O are required while operating across an industrial temperature range.

Key Features

• Logic Capacity  1,100,000 logic elements provide large-scale programmable resources for complex algorithms and high-density designs.
• On‑Chip Memory  112,197,632 total RAM bits of embedded memory to support buffering, lookup tables, and large data storage on-chip.
• I/O Density  688 I/O pins support extensive external connectivity for interfaces, high-speed links, and parallel buses.
• Package & Mounting  1760‑BBGA (FCBGA) package, supplier package specified as 1760‑FBGA (42.5 × 42.5 mm); surface mount mounting type for board-level integration.
• Power Supply  Core voltage range 770 mV to 970 mV to match system power-rail design requirements.
• Temperature & Grade  Industrial grade device rated for operation from ‑40 °C to 100 °C for deployment in industrial and rugged environments.
• Family Innovations (Stratix 10)  Family-level features include the Intel Hyperflex core architecture and 14 nm tri‑gate (FinFET) technology that enable higher core performance and improved power efficiency.
• Compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• High‑performance networking and telecom  Large logic capacity and high I/O count suit packet processing, switching, and line-card applications that require extensive parallel processing and connectivity.
• Data center acceleration  On‑chip RAM and massive logic resources enable custom acceleration of compute and data-path functions in server and appliance designs.
• Signal processing and high‑bandwidth interfaces  The combination of dense logic and substantial embedded memory supports DSP chains, protocol handling, and high‑speed serial/parallel I/O tasks.

Unique Advantages

• Massive programmable fabric: 1,100,000 logic elements give designers the headroom to implement large, integrated systems on a single device, reducing the need for multiple FPGAs.
• Significant on‑chip memory: Over 112 million bits of RAM reduce external memory dependence and lower system latency for buffering and data staging.
• High I/O count: 688 I/Os enable broad peripheral connectivity and high‑density interface implementation without additional I/O expanders.
• Industrial temperature range: Rated from ‑40 °C to 100 °C for reliable operation in industrial and harsh environments.
• Proven family technology: Benefits from Stratix 10 family innovations such as the Hyperflex core architecture and 14 nm FinFET process for improved performance and efficiency at the silicon level.
• RoHS compliant: Meets RoHS requirements to aid compliance with environmental regulations.

Why Choose 1SG110HN3F43I1VG?

The 1SG110HN3F43I1VG positions itself as a high‑density, industrial‑grade FPGA option within the Stratix 10 GX family, combining 1.1 million logic elements, substantial embedded RAM, and a 688‑pin I/O footprint in a single 1760‑FBGA package. These attributes make it suitable for system designs that require consolidated logic, large on‑chip memory, and extensive external connectivity.

Choosing this part offers long-term design scalability within the Stratix 10 family architecture and access to family-level innovations such as the Hyperflex core and 14 nm FinFET process, delivering a balance of performance and integration for demanding networking, data center, and signal processing applications.

Request a quote or contact sales for pricing, lead time, and availability for part 1SG110HN3F43I1VG.