1SG110HN3F43I2VG

The 1SG110HN3F43I2VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760-BBGA FCBGA package. It combines a high-density programmable fabric with a broad I/O complement and substantial on-chip memory to address advanced, high-bandwidth processing and system integration requirements.

Built on the Stratix® 10 family architecture, this device targets designs that require large logic capacity, extensive I/O, and industrial temperature operation, delivering integration and performance for compute-, networking-, and signal-processing-focused systems.

Key Features

• High Logic Capacity  1,100,000 logic elements to implement large-scale digital designs and complex custom logic.
• On-chip Memory  112,197,632 total RAM bits for deep buffering, large FIFOs, and memory-intensive algorithms.
• Extensive I/O  688 I/Os to support wide parallel interfaces, multiple protocols, and high pin-count systems.
• Core Architecture  Stratix® 10 GX family architecture (Hyperflex core technology described in the device overview) for higher core performance within the series.
• Power Supply Range  Core supply support from 770 mV to 970 mV to match system power delivery designs.
• Package  1760-BBGA FCBGA (supplier device package: 1760-FBGA, 42.5 × 42.5 mm) for high pin count and dense system placement.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
• Surface Mount  Surface-mount package compatible with standard PCB assembly flows for compact system integration.
• RoHS Compliant  Meets RoHS requirements for reduced hazardous substances in the bill of materials.

Typical Applications

• High‑Performance Networking  Implement line-rate processing, packet handling, and protocol offload with the device's large logic capacity and extensive I/O.
• Data Center Acceleration  Use the FPGA fabric and on-chip memory for custom compute acceleration, real-time data manipulation, and PCIe-based system integration.
• Signal Processing and DSP  Large RAM and dense logic enable complex filtering, channel processing, and aggregation tasks in communications and instrumentation systems.
• Industrial Systems  Industrial temperature rating and comprehensive I/O support integration into factory automation, test equipment, and control systems.

Unique Advantages

• Massive FPGA Fabric: 1,100,000 logic elements provide the headroom to implement large, multi-function designs without partitioning across multiple devices.
• Large On-Die Memory: 112,197,632 RAM bits reduce reliance on external memory for buffering and state storage, simplifying system design and improving latency.
• Broad I/O Count: 688 I/Os enable simultaneous connectivity to many peripherals, interfaces, and parallel buses, minimizing external multiplexing.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Compact, High‑Density Package: 1760-BBGA FCBGA (42.5 × 42.5 mm) gives high pin density in a compact footprint suitable for space-constrained boards.
• Flexible Power Input: Core voltage range of 770 mV to 970 mV accommodates a variety of power delivery strategies and regulator designs.

Why Choose 1SG110HN3F43I2VG?

The 1SG110HN3F43I2VG positions itself as a high-density Stratix® 10 GX FPGA option for designs that require substantial logic, memory, and I/O in an industrial-temperature package. Its combination of 1,100,000 logic elements, more than 112 million RAM bits, and 688 I/Os supports complex, integrated systems for networking, compute acceleration, and signal processing.

Designed for system-level integration and long-term deployment, this device leverages the Stratix® 10 family architecture to deliver scalability for evolving designs while meeting industrial operational requirements and RoHS compliance.

Request a quote or submit an inquiry today to check pricing, lead times, and availability for the 1SG110HN3F43I2VG.