1SG110HN3F43I3XG

The 1SG110HN3F43I3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package designed for high‑density, high‑performance system designs. It leverages the Stratix 10 family architecture—featuring Intel’s Hyperflex core and 14 nm tri‑gate (FinFET) technology—to address demanding applications that require large logic capacity, significant on‑chip RAM, and extensive I/O.

This industrial‑grade device targets applications that need high logic density, advanced transceiver and DSP capabilities, and robust thermal and power margins across an extended operating range.

Key Features

• Logic Capacity — 1,100,000 logic elements (logic cells) to implement large, complex FPGA designs and system functions.
• On‑Chip Memory — 112,197,632 total RAM bits for high‑bandwidth buffering, large lookup tables, and state storage.
• High I/O Count — 688 user I/O pins to support wide buses, multiple interfaces, and high channel counts.
• Advanced Core Architecture — Built on the Stratix 10 family with the Intel Hyperflex core architecture and 14 nm tri‑gate process, enabling higher core performance and efficiency as described for the family.
• Transceiver and DSP Capabilities (Family‑Level) — Stratix 10 GX family innovations include high‑speed transceivers and variable‑precision DSP blocks as described in the device overview.
• Package and Mounting — Surface mount device in a 1760‑BBGA/1760‑FBGA package (42.5 × 42.5 mm) suitable for dense board layouts.
• Supply Voltage — Core supply range of 820 mV to 880 mV to match system power design constraints.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• High‑Performance Networking — Implement packet processing, switch fabrics, and protocol offload functions that require large logic resources and abundant I/O.
• Data Center Acceleration — Deploy custom compute kernels, high‑throughput data movers, and buffering using substantial on‑chip RAM and DSP capabilities available in the Stratix 10 family.
• Telecommunications — Support line‑rate interfaces, forward error correction, and multi‑lane transceiver systems where high logic density and family transceiver features are needed.
• Signal Processing and FPGA Compute — Use the extensive logic and RAM for complex signal processing pipelines and algorithm acceleration leveraging family DSP resources.

Unique Advantages

• Large Logic Fabric: 1,100,000 logic elements enable consolidation of multi‑function systems into a single device, reducing board complexity.
• Substantial On‑Chip Memory: Over 112 million bits of RAM support large buffering and stateful logic without immediate dependence on external memory.
• Extensive I/O: 688 I/O pins allow flexible partitioning of interfaces and support for numerous parallel channels and bus standards.
• Industrial Reliability: Specified for −40 °C to 100 °C operation and surface‑mount packaging for reliable deployment in industrial systems.
• Family‑Level Performance Features: Benefits from Stratix 10 family innovations such as the Hyperflex core and 14 nm FinFET process for improved core performance and power efficiency.
• Practical Packaging: 1760‑FBGA (42.5 × 42.5 mm) form factor supports dense, high‑pin‑count board designs while simplifying thermal and mechanical integration.

Why Choose 1SG110HN3F43I3XG?

The 1SG110HN3F43I3XG positions itself as a high‑density Stratix 10 GX FPGA option for engineers who need large logic capacity, extensive on‑chip RAM, and a high I/O count in an industrial‑rated package. Its alignment with Stratix 10 family technologies provides access to advanced core architecture and family‑level transceiver and DSP capabilities.

This device is well suited for system designers building high‑bandwidth networking, telecom, data center acceleration, or signal processing products that require scalable logic resources, robust thermal margins, and a mature FPGA architecture backed by family documentation and tooling.

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