1SG165HN1F43E2VG

The 1SG165HN1F43E2VG is an Intel Stratix® 10 GX high-performance FPGA in a 1760-ball BGA (FCBGA) package. It is built on the Stratix 10 device family innovations and Hyperflex core architecture described in the device overview, delivering a design platform focused on high bandwidth and high compute-density applications.

With 1,650,000 logic elements, 119,537,664 total RAM bits and 688 user I/O, this surface-mount device targets demanding applications that require large programmable fabric, extensive embedded memory and broad I/O connectivity while operating from a low-voltage core supply range of 770 mV to 970 mV.

Key Features

• Core Architecture  Built on the Intel Stratix 10 family innovations including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology as described in the device documentation.
• Logic Capacity  1,650,000 logic elements (logic element cells) for large FPGA designs and complex logic integration.
• Embedded Memory  119,537,664 total RAM bits to support packet buffering, frame storage, and on-chip data processing.
• I/O and Connectivity  688 user I/O pins to support wide external interfacing and system integration requirements.
• Package and Mounting  1760-BBGA (1760-FBGA, 42.5 × 42.5) package; surface-mount for high-density board designs.
• Power and Voltage  Core supply range of 770 mV to 970 mV to match low-voltage system architectures.
• Operating Range and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.
• Family-Level Innovations  As part of the Stratix 10 GX family, the device benefits from family features such as advanced transceiver and PLL technologies outlined in the Stratix 10 overview documentation.

Typical Applications

• High-performance networking: Use where large programmable logic capacity and extensive I/O are needed for switching, packet processing, and interface bridging.
• Data center acceleration: Implement custom accelerators and offload engines that require significant on-chip logic and embedded memory.
• High-speed communications: Deploy in systems that require broad I/O and dense fabric for protocol handling and high-throughput signal processing.
• Compute-intensive signal processing: Integrate large DSP and memory resources to support real-time processing and buffering tasks.

Unique Advantages

• High logic density: 1,650,000 logic elements enable complex, large-scale designs without partitioning across multiple devices.
• Substantial on-chip memory: 119,537,664 RAM bits reduce external memory dependency for many buffering and data-path tasks.
• Extensive I/O availability: 688 I/O pins support wide external connectivity and flexible board-level interfacing.
• Advanced packaging: 1760-FBGA (42.5 × 42.5) package supports high pin-count, surface-mount system implementations for compact, dense boards.
• Low-voltage core operation: 770 mV to 970 mV core supply range aligns with modern low-voltage design practices to help manage power.
• Extended temperature grade: Rated 0 °C to 100 °C to meet applications requiring a broader commercial operating envelope.

Why Choose 1SG165HN1F43E2VG?

The 1SG165HN1F43E2VG provides a high-capacity Stratix 10 GX FPGA platform combining 1.65 million logic elements, large embedded memory, and hundreds of I/O in a single 1760-ball FCBGA package. It is positioned for designs that need substantial programmable fabric, wide connectivity and on-chip memory while operating within a low-voltage core domain.

This device is suited to engineering teams developing bandwidth- and compute-intensive systems who require a scalable, feature-rich FPGA option from the Stratix 10 family and who value platform-level innovations documented for the family.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for the 1SG165HN1F43E2VG. Technical datasheet and device documentation are available to support evaluation and integration planning.