1SG165HN2F43I2VGAS

The 1SG165HN2F43I2VGAS is an Intel Stratix® 10 GX field-programmable gate array (FPGA) packaged in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package. It provides very high logic density and on-chip memory together with a large I/O count for advanced, high-performance applications.

Built on the Stratix 10 GX family architecture, this device leverages Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology to address demanding processing and bandwidth requirements while supporting industrial temperature operation.

Key Features

• Core Density  1,650,000 logic elements for extensive programmable logic capacity to implement large-scale, complex designs.
• Logic Structure  206,250 CLB-like building blocks reported in the product data to represent the device’s configurable logic fabric.
• On‑chip Memory  Total RAM bits: 119,537,664, providing large embedded storage for buffers, FIFOs, and accelerator local memory.
• I/O Capacity  688 user I/O pins to support wide parallel interfaces and multi-lane connectivity.
• Power and Core Supply  Core voltage supply range of 770 mV to 970 mV for the device core operating region.
• Package and Mounting  1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package for high-density board integration.
• Operating Range  Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Stratix 10 Family Innovations  Leverages Stratix 10 GX family-level technologies including the Intel Hyperflex core architecture, heterogeneous 3D SiP transceiver tiles, and FinFET process advantages as described in the device overview.
• Reliability and Security  Includes family-level provisions such as Single Event Upset (SEU) error detection and correction and device security features documented in the Stratix 10 device overview.

Typical Applications

• High‑performance networking and data center  Large logic capacity, substantial on-chip memory, and high I/O counts suit packet processing, custom switching, and acceleration tasks described for high-bandwidth applications.
• Communications and backplane systems  Stratix 10 GX family transceiver and interface capabilities are aligned with use in high-speed link aggregation and complex protocol handling.
• Compute acceleration and signal processing  Extensive logic and memory resources support variable-precision DSP implementations and hardware acceleration for compute‑intensive workloads.
• Industrial and ruggedized systems  Industrial temperature rating (−40 °C to 100 °C) enables deployment in thermally demanding environments and industrial equipment.

Unique Advantages

• High logic density: 1,650,000 logic elements provide the capacity to consolidate large portions of complex systems into a single device, reducing board-level component count.
• Substantial on‑chip memory: 119,537,664 total RAM bits allow local buffering and memory-centric accelerators without immediate external memory dependency.
• Large I/O complement: 688 I/O pins enable extensive parallel interfacing and multi-lane connectivity for diverse system topologies.
• Industrial temperature support: Rated from −40 °C to 100 °C to meet the thermal requirements of industrial and rugged applications.
• Compact high‑density package: 1760-FBGA (42.5 × 42.5 mm) package delivers high pin count in a manufacturable surface-mount form factor.
• Family-level technology benefits: Incorporates Stratix 10 GX family innovations such as the Intel Hyperflex architecture and 14 nm tri-gate process advantages for improved performance-per-watt characteristics described in the device overview.

Why Choose 1SG165HN2F43I2VGAS?

This Stratix 10 GX device is positioned for engineers who require high programmable logic capacity, extensive embedded RAM, and a high I/O count within an industrial-temperature, surface-mount package. It brings Stratix 10 family architectural advances to designs that demand significant on-chip resources and robust thermal operating range.

For designs that need scalability and the ability to integrate complex functions on a single FPGA platform, the 1SG165HN2F43I2VGAS offers a combination of density, memory, and I/O in a proven Stratix 10 GX family footprint documented in the device overview.

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