1SG165HN2F43I2VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1650000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 45 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 206250 | Number of Logic Elements/Cells | 1650000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 119537664 |
Overview of 1SG165HN2F43I2VGAS – Stratix® 10 GX FPGA, 1,650,000 logic elements, 688 I/O, 1760-BBGA
The 1SG165HN2F43I2VGAS is an Intel Stratix® 10 GX field-programmable gate array (FPGA) packaged in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package. It provides very high logic density and on-chip memory together with a large I/O count for advanced, high-performance applications.
Built on the Stratix 10 GX family architecture, this device leverages Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology to address demanding processing and bandwidth requirements while supporting industrial temperature operation.
Key Features
- Core Density 1,650,000 logic elements for extensive programmable logic capacity to implement large-scale, complex designs.
- Logic Structure 206,250 CLB-like building blocks reported in the product data to represent the device’s configurable logic fabric.
- On‑chip Memory Total RAM bits: 119,537,664, providing large embedded storage for buffers, FIFOs, and accelerator local memory.
- I/O Capacity 688 user I/O pins to support wide parallel interfaces and multi-lane connectivity.
- Power and Core Supply Core voltage supply range of 770 mV to 970 mV for the device core operating region.
- Package and Mounting 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package for high-density board integration.
- Operating Range Industrial grade with an operating temperature range of −40 °C to 100 °C.
- Stratix 10 Family Innovations Leverages Stratix 10 GX family-level technologies including the Intel Hyperflex core architecture, heterogeneous 3D SiP transceiver tiles, and FinFET process advantages as described in the device overview.
- Reliability and Security Includes family-level provisions such as Single Event Upset (SEU) error detection and correction and device security features documented in the Stratix 10 device overview.
Typical Applications
- High‑performance networking and data center Large logic capacity, substantial on-chip memory, and high I/O counts suit packet processing, custom switching, and acceleration tasks described for high-bandwidth applications.
- Communications and backplane systems Stratix 10 GX family transceiver and interface capabilities are aligned with use in high-speed link aggregation and complex protocol handling.
- Compute acceleration and signal processing Extensive logic and memory resources support variable-precision DSP implementations and hardware acceleration for compute‑intensive workloads.
- Industrial and ruggedized systems Industrial temperature rating (−40 °C to 100 °C) enables deployment in thermally demanding environments and industrial equipment.
Unique Advantages
- High logic density: 1,650,000 logic elements provide the capacity to consolidate large portions of complex systems into a single device, reducing board-level component count.
- Substantial on‑chip memory: 119,537,664 total RAM bits allow local buffering and memory-centric accelerators without immediate external memory dependency.
- Large I/O complement: 688 I/O pins enable extensive parallel interfacing and multi-lane connectivity for diverse system topologies.
- Industrial temperature support: Rated from −40 °C to 100 °C to meet the thermal requirements of industrial and rugged applications.
- Compact high‑density package: 1760-FBGA (42.5 × 42.5 mm) package delivers high pin count in a manufacturable surface-mount form factor.
- Family-level technology benefits: Incorporates Stratix 10 GX family innovations such as the Intel Hyperflex architecture and 14 nm tri-gate process advantages for improved performance-per-watt characteristics described in the device overview.
Why Choose 1SG165HN2F43I2VGAS?
This Stratix 10 GX device is positioned for engineers who require high programmable logic capacity, extensive embedded RAM, and a high I/O count within an industrial-temperature, surface-mount package. It brings Stratix 10 family architectural advances to designs that demand significant on-chip resources and robust thermal operating range.
For designs that need scalability and the ability to integrate complex functions on a single FPGA platform, the 1SG165HN2F43I2VGAS offers a combination of density, memory, and I/O in a proven Stratix 10 GX family footprint documented in the device overview.
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