1SG165HN3F43I2VGAS

The 1SG165HN3F43I2VGAS is a Stratix® 10 GX field programmable gate array (FPGA) with a high-density logic fabric and extensive on-chip memory, designed for advanced, high-performance applications. It implements Intel's Stratix 10 family innovations including the Hyperflex core architecture and 14 nm tri-gate (FinFET) process as described in the device overview.

Targeted use cases include systems that require large logic capacity, substantial embedded RAM, and broad I/O connectivity within an industrial temperature range. The device combines 1,650,000 logic elements, 119,537,664 total RAM bits, and 688 I/O pins in a 1760-BBGA surface-mount package.

Key Features

• Core and Process Technology Intel Hyperflex core architecture on 14 nm tri-gate (FinFET) process as described for the Stratix 10 GX family.
• Logic Capacity 1,650,000 logic elements to support large-scale programmable logic designs.
• Embedded Memory 119,537,664 total RAM bits of on-chip memory for buffering, frame storage, and high-bandwidth data processing.
• I/O and High-Speed Interfaces 688 I/O pins to accommodate wide external connectivity. The Stratix 10 family overview describes high-speed transceiver technology used across GX devices.
• Package and Mounting 1760-BBGA (FCBGA) surface-mount package; supplier device package listed as 1760-FBGA (42.5 × 42.5 mm).
• Voltage Supply Core voltage range from 770 mV to 970 mV for device core operation.
• Temperature and Grade Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Compliance RoHS compliant.

Typical Applications

• High-Bandwidth Networking and Telecom Enables packet-processing, switch/router, and backplane applications that benefit from large logic fabric and extensive I/O.
• Data Center Acceleration Suitable for FPGA-based accelerators and preprocessing engines that require high logic capacity and substantial on-chip memory.
• Signal Processing and DSP Supports complex signal chain implementations where large embedded RAM and dense logic are required for buffering and computation.
• Industrial Systems and Test Equipment Industrial-grade temperature range and robust I/O make it applicable for automation, imaging, and instrumentation systems.

Unique Advantages

• High Logic Density: 1,650,000 logic elements enable integration of large, complex designs on a single device, reducing board-level complexity.
• Substantial On-Chip Memory: 119,537,664 RAM bits provide ample local storage for high-throughput data paths and buffering needs.
• Extensive I/O Count: 688 I/Os facilitate broad external connectivity and parallel interfaces without external expander requirements.
• Industrial Qualification: −40 °C to 100 °C operating range supports deployment in demanding industrial environments.
• Compact High-Density Package: 1760-BBGA (42.5 × 42.5 mm) surface-mount package balances board space and I/O density for complex system designs.
• Low-Voltage Core Operation: 770 mV to 970 mV supply range for the device core supports designs targeting optimized power domains.

Why Choose 1SG165HN3F43I2VGAS?

The 1SG165HN3F43I2VGAS combines large-scale programmable logic, significant on-chip memory, and a high pin count in an industrial-grade Stratix 10 GX device. It is suited to engineering teams building high-bandwidth, computation-intensive systems that require consolidation of logic and memory into a single FPGA platform.

Backed by the Stratix 10 device family architecture and documentation, this device offers a clear upgrade path for designs that need scalable logic resources, robust I/O capability, and the thermal robustness required for industrial deployments.

Request a quote or submit an RFQ to evaluate the 1SG165HN3F43I2VGAS for your next high-performance FPGA design.