1SG165HU1F50I2VG

IC FPGA 704 I/O 2397BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 1650000 2397-BBGA, FCBGA

Quantity 102 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O704Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs206250Number of Logic Elements/Cells1650000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits119537664

Overview of 1SG165HU1F50I2VG – Stratix® 10 GX FPGA, 1,650,000 Logic Elements, 704 I/O

The 1SG165HU1F50I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397-BBGA FCBGA package, providing 1,650,000 logic elements and 704 I/O for high-density, high-bandwidth designs. Built on the Stratix 10 family innovations—including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology—this device targets advanced, performance-driven applications that require large logic capacity, substantial on-chip memory, and industrial operating range.

Key Features

  • Core Architecture  Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) technology from the Stratix 10 family, delivering the family-level improvements in core performance and efficiency described in the device overview.
  • Logic Capacity  1,650,000 logic elements (LEs) to implement large, complex FPGA designs and custom accelerators.
  • On-Chip Memory  119,537,664 total RAM bits for embedded SRAM storage to support buffering, packet processing, and memory-intensive logic.
  • I/O and Package  704 I/O pins in a 2397-BBGA (2397-FBGA, FC 50×50) package; surface-mount package suited for dense board designs.
  • Transceiver and IP Capabilities (Family-Level)  Stratix 10 family features include high-speed transceivers with data rates up to 28.3 Gbps, hard PCI Express Gen3 x16 IP, hard 10G/40G Ethernet FEC in transceiver channels, and support for high-speed external memories (DDR4 up to 2666 Mbps per pin).
  • DSP and Compute (Family-Level)  Variable-precision DSP blocks capable of high compute throughput (family-level figures include up to 10 TFLOP compute performance with power efficiency metrics described in the device overview).
  • Power Supply  Core voltage supply range of 770 mV to 970 mV for device operation.
  • Operating Range & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance for environmental compatibility.

Typical Applications

  • High-performance networking and switching  Large logic capacity, substantial on-chip memory, and family-level high-speed transceivers suit backplane, switch, and router designs that demand bandwidth and protocol IP such as PCIe and Ethernet.
  • Compute acceleration and DSP  High DSP throughput and 1,650,000 logic elements enable signal processing, packet inspection, and custom accelerator implementations.
  • Data center and interconnect  Family-level support for high-speed transceivers and hard PCIe IP supports server and interconnect applications requiring multi‑lane links and low-latency data movement.
  • Industrial systems  Industrial operating temperature range and robust package make the device suitable for demanding embedded and control-system deployments.

Unique Advantages

  • Large programmable fabric: 1,650,000 logic elements provide headroom for complex designs and system integration that reduce external components.
  • Substantial on-chip memory: Nearly 120 Mbits of RAM allow heavy buffering and stateful processing without immediate reliance on external memory.
  • High I/O density: 704 I/O pins in a 2397-BBGA package enable rich external connectivity for multi-channel interfaces and parallel data paths.
  • Family-proven high-speed features: Stratix 10 family transceiver and IP capabilities (including multi-gigabit transceivers and PCIe/Ethernet hard IP) support modern high-bandwidth system requirements.
  • Industrial temperature operation: Rated for −40 °C to 100 °C to meet performance needs in harsher environmental conditions.
  • Regulatory and manufacturing readiness: Surface-mount FCBGA package and RoHS compliance facilitate integration into modern production workflows.

Why Choose 1SG165HU1F50I2VG?

The 1SG165HU1F50I2VG combines the Stratix 10 family’s architectural advancements with a large logic fabric, extensive on-chip RAM, and a high I/O count to address demanding, bandwidth- and compute-intensive designs. Its industrial operating range and FCBGA package support deployment in robust embedded and infrastructure applications where density and performance are required.

This device is suited for engineering teams building high-performance networking, compute acceleration, and industrial systems who need a scalable FPGA platform leveraging Stratix 10 family innovations such as the Hyperflex core architecture and advanced transceiver/IP features.

Request a quote or submit a pricing inquiry to receive availability and procurement details for 1SG165HU1F50I2VG.

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