1SG165HU1F50I2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 1650000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 102 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 206250 | Number of Logic Elements/Cells | 1650000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 119537664 |
Overview of 1SG165HU1F50I2VG – Stratix® 10 GX FPGA, 1,650,000 Logic Elements, 704 I/O
The 1SG165HU1F50I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397-BBGA FCBGA package, providing 1,650,000 logic elements and 704 I/O for high-density, high-bandwidth designs. Built on the Stratix 10 family innovations—including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology—this device targets advanced, performance-driven applications that require large logic capacity, substantial on-chip memory, and industrial operating range.
Key Features
- Core Architecture Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) technology from the Stratix 10 family, delivering the family-level improvements in core performance and efficiency described in the device overview.
- Logic Capacity 1,650,000 logic elements (LEs) to implement large, complex FPGA designs and custom accelerators.
- On-Chip Memory 119,537,664 total RAM bits for embedded SRAM storage to support buffering, packet processing, and memory-intensive logic.
- I/O and Package 704 I/O pins in a 2397-BBGA (2397-FBGA, FC 50×50) package; surface-mount package suited for dense board designs.
- Transceiver and IP Capabilities (Family-Level) Stratix 10 family features include high-speed transceivers with data rates up to 28.3 Gbps, hard PCI Express Gen3 x16 IP, hard 10G/40G Ethernet FEC in transceiver channels, and support for high-speed external memories (DDR4 up to 2666 Mbps per pin).
- DSP and Compute (Family-Level) Variable-precision DSP blocks capable of high compute throughput (family-level figures include up to 10 TFLOP compute performance with power efficiency metrics described in the device overview).
- Power Supply Core voltage supply range of 770 mV to 970 mV for device operation.
- Operating Range & Grade Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance for environmental compatibility.
Typical Applications
- High-performance networking and switching Large logic capacity, substantial on-chip memory, and family-level high-speed transceivers suit backplane, switch, and router designs that demand bandwidth and protocol IP such as PCIe and Ethernet.
- Compute acceleration and DSP High DSP throughput and 1,650,000 logic elements enable signal processing, packet inspection, and custom accelerator implementations.
- Data center and interconnect Family-level support for high-speed transceivers and hard PCIe IP supports server and interconnect applications requiring multi‑lane links and low-latency data movement.
- Industrial systems Industrial operating temperature range and robust package make the device suitable for demanding embedded and control-system deployments.
Unique Advantages
- Large programmable fabric: 1,650,000 logic elements provide headroom for complex designs and system integration that reduce external components.
- Substantial on-chip memory: Nearly 120 Mbits of RAM allow heavy buffering and stateful processing without immediate reliance on external memory.
- High I/O density: 704 I/O pins in a 2397-BBGA package enable rich external connectivity for multi-channel interfaces and parallel data paths.
- Family-proven high-speed features: Stratix 10 family transceiver and IP capabilities (including multi-gigabit transceivers and PCIe/Ethernet hard IP) support modern high-bandwidth system requirements.
- Industrial temperature operation: Rated for −40 °C to 100 °C to meet performance needs in harsher environmental conditions.
- Regulatory and manufacturing readiness: Surface-mount FCBGA package and RoHS compliance facilitate integration into modern production workflows.
Why Choose 1SG165HU1F50I2VG?
The 1SG165HU1F50I2VG combines the Stratix 10 family’s architectural advancements with a large logic fabric, extensive on-chip RAM, and a high I/O count to address demanding, bandwidth- and compute-intensive designs. Its industrial operating range and FCBGA package support deployment in robust embedded and infrastructure applications where density and performance are required.
This device is suited for engineering teams building high-performance networking, compute acceleration, and industrial systems who need a scalable FPGA platform leveraging Stratix 10 family innovations such as the Hyperflex core architecture and advanced transceiver/IP features.
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