1SG165HN3F43I3VG

The 1SG165HN3F43I3VG is an Intel Stratix® 10 GX field programmable gate array supplied in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package for surface-mount applications. It delivers high integration with 1,650,000 logic elements, 119,537,664 bits of on-chip RAM, and 688 I/O pins, making it suitable for demanding industrial designs that require large programmable fabric and significant on-chip memory.

Built on the Stratix 10 GX family architecture, the device emphasizes core performance and advanced fabric capabilities, addressing use cases that require high processing throughput, large memory capacity, and extensive I/O connectivity while operating across a wide industrial temperature range.

Key Features

• Core Logic  1,650,000 logic elements provide a large programmable fabric for complex logic integration and system acceleration.
• On-chip Memory  119,537,664 total RAM bits support large buffering, state storage, and memory-intensive logic functions.
• I/O Capacity  688 user I/O pins enable extensive external interfacing for multi-channel systems and high-density board designs.
• Power Supply Range  Operates from 770 mV to 970 mV, allowing integration with modern low-voltage power domains.
• Thermal and Grade  Industrial grade operation from -40°C to 100°C supports deployment in industrial environments.
• Package and Mounting  1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package provides a high-pin-count, compact form factor for dense system designs.
• Stratix 10 Family Innovations  As part of the Stratix 10 GX series, the device benefits from the Intel Hyperflex core architecture, 14 nm tri-gate (FinFET) technology, and family-level features such as high-performance transceivers, advanced DSP blocks, and programmable clocking (as described in the Stratix 10 GX/SX overview).

Typical Applications

• High-bandwidth Networking  Large logic capacity and extensive I/O support complex packet processing, switch fabric functions, and high-throughput system designs.
• Data Center Acceleration  Substantial on-chip RAM and logic elements enable hardware acceleration for compute offload, packet inspection, and custom data-paths.
• Telecommunications Equipment  Industrial temperature operation and high I/O count suit backplane and module-level implementations in telecom infrastructure.
• Signal Processing and DSP  Ample memory and fabric resources accommodate large DSP pipelines and custom signal-processing blocks.

Unique Advantages

• Massive Programmable Fabric: 1,650,000 logic elements allow integration of complex system functions into a single device, reducing board-level component count.
• Large On-Chip Memory: 119,537,664 RAM bits enable deep buffering and storage for high-throughput data paths without relying solely on external memory.
• High I/O Density: 688 I/O pins simplify multi-channel interfacing and reduce the need for external I/O expanders or multiplexing.
• Industrial Temperature Range: Rated from -40°C to 100°C for reliable operation in industrial environments and harsher thermal conditions.
• Compact High-Pin Package: 1760-BBGA (42.5 × 42.5 mm) balances pin count and board area for dense, manufacturable designs.
• Family-Level Performance Features: Leverages Stratix 10 GX architecture innovations—such as the Intel Hyperflex core and 14 nm FinFET process—designed for increased core performance and power efficiency across the family.

Why Choose 1SG165HN3F43I3VG?

The 1SG165HN3F43I3VG combines a very large logic fabric, extensive on-chip memory, and high I/O capacity in an industrial-grade, surface-mount 1760-BBGA package. It is well suited to system designs that require substantial programmable resources, deterministic on-chip memory, and robust I/O connectivity within industrial temperature environments.

For designers targeting high-throughput networking, data-center acceleration, telecom modules, or advanced signal-processing systems, this Stratix® 10 GX device offers a scalable platform that consolidates complex functions and reduces system-level component count while aligning with modern low-voltage power domains.

If you’d like pricing, availability, or to request a formal quote for 1SG165HN3F43I3VG, submit a quote request or contact our sales team for assistance.