1SG165HU1F50E2VG

The 1SG165HU1F50E2VG is a Stratix® 10 GX FPGA from Intel, delivering a high-capacity programmable fabric for demanding digital designs. It is built on the Stratix 10 family architecture and leverages the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process as described for the device family.

This device targets applications requiring large logic capacity, substantial on-chip memory, and high I/O density. Key value comes from its high logic element count, significant embedded RAM, broad I/O, and advanced family-level features such as hard IP blocks and high-performance transceiver capability described in the Stratix 10 GX overview.

Key Features

• Core & Architecture  Part of the Intel Stratix 10 GX family built on the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology (family-level features).
• Logic Density  1,650,000 logic elements, suitable for large-scale programmable logic implementations.
• Embedded Memory  119,537,664 total RAM bits to support large on-chip buffering, tables, and memory-intensive algorithms.
• I/O  704 I/O pins provide extensive external connectivity for parallel interfaces and high-pin-count designs.
• Power and Voltage  Core supply range specified at 770 mV to 970 mV.
• Package and Mounting  2397-BBGA FCBGA package (50 × 50) for surface-mount PCB implementations.
• Operating Range & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Family-Level Connectivity & IP  Stratix 10 GX family documentation highlights hard IP and high-speed transceiver capabilities (including PCI Express and high-speed Ethernet hard IPs and advanced transceiver features).
• Compliance  RoHS compliant.

Typical Applications

• High‑speed networking and communications  Use the device where large programmable logic capacity and high I/O count enable packet processing, protocol offload, and backplane interfacing leveraging the Stratix 10 family transceiver and hard IP features.
• Data center and compute acceleration  Large logic and embedded RAM support acceleration functions and custom compute pipelines.
• High‑performance signal processing  Substantial on-chip memory and logic capacity enable complex DSP and real‑time processing pipelines.
• Prototyping and system integration  High I/O count and a high-density BGA package facilitate integration into complex system prototypes and evaluation platforms.

Unique Advantages

• High logic capacity: 1,650,000 logic elements allow implementation of very large designs without partitioning across multiple devices.
• Large on‑chip RAM: 119,537,664 total RAM bits reduce dependence on external memory for many buffering and table‑based tasks.
• Broad external connectivity: 704 I/O pins provide flexibility for multi-channel interfaces and high-pin-count peripherals.
• Advanced family architecture: The Intel Hyperflex core architecture and 14 nm FinFET process (Stratix 10 family attributes) offer a modern foundation for performance‑oriented designs.
• Robust packaging: 2397‑BBGA FCBGA (50 × 50) surface-mount package supports compact, high-density PCB layouts.
• Extended operating range: Grade and specified 0 °C to 100 °C operating range accommodate a wide set of commercial and extended-temperature applications.

Why Choose 1SG165HU1F50E2VG?

The 1SG165HU1F50E2VG delivers a combination of very high logic density, large embedded memory, and extensive I/O in a single Stratix 10 GX FPGA package. It is well suited for engineers building high-bandwidth, compute-intensive, or memory‑heavy systems that benefit from the Stratix 10 family’s architectural innovations.

This device is targeted at designs that require scaleable programmable logic capacity, significant on‑chip storage, and broad external interfacing while maintaining a compact, surface‑mount package and extended operating range. Selecting this FPGA supports long-term design headroom and integration with the Stratix 10 family ecosystem as described in the device overview.

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