1SG165HU2F50I2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 1650000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 17 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 206250 | Number of Logic Elements/Cells | 1650000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 119537664 |
Overview of 1SG165HU2F50I2VG – Stratix® 10 GX FPGA, 1,650,000 Logic Elements, 704 I/O, 2397-BBGA
The 1SG165HU2F50I2VG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) in a 2397-BBGA (FCBGA) package, offering 1,650,000 logic elements and 704 user I/O for demanding, compute- and I/O-intensive designs. This device is part of the Stratix 10 GX family, which leverages the Intel Hyperflex core architecture and Intel 14 nm FinFET process to deliver family-level improvements in core performance and power efficiency.
Targeted at high-performance applications that require large programmable fabric, abundant on-chip memory, and industrial operating range, the device combines high logic and memory capacity with flexible I/O and package options to support complex networking, signal processing, and acceleration tasks.
Key Features
- Core & architecture Family-level Intel Hyperflex core architecture and 14 nm Intel FinFET process, delivering enhanced core performance and efficiency across the Stratix 10 GX family.
- Logic capacity 1,650,000 logic elements, providing significant programmable fabric for complex logic and custom processing pipelines.
- On-chip memory 119,537,664 total RAM bits to support large buffers, frame storage, and intermediate data for high-throughput designs.
- I/O and package 704 user I/O in a 2397-BBGA (FCBGA) surface-mount package; supplier device package listed as 2397-FBGA, FC (50×50).
- Voltage and power Core voltage supply range from 770 mV to 970 mV to match system power rails and enable platform power planning.
- Temperature and grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS compliant.
- Family-level system features Stratix 10 GX family documentation highlights advanced capabilities such as high-speed transceivers, variable-precision DSP blocks, hard IP for PCIe and Ethernet, and device configuration/security features, which are part of the Stratix 10 GX/SX device overview.
Typical Applications
- High-performance networking and switch fabrics Large logic capacity and abundant I/O support packet processing, traffic management, and line-rate protocol implementations.
- Data center acceleration Substantial on-chip RAM and logic resources enable custom accelerators and offload engines for compute- and memory-intensive workloads.
- Signal processing and communications High logic density combined with family-level DSP and transceiver capabilities supports real-time processing, encoding/decoding, and modulation tasks.
- Broadcast and video infrastructure Large memory capacity and I/O counts support multi-channel video processing, frame buffering, and format conversion pipelines.
Unique Advantages
- High programmable capacity: 1,650,000 logic elements enable integration of large custom datapaths and control logic in one device, reducing system complexity.
- Large on-chip memory: 119,537,664 total RAM bits provide ample storage for buffering, packet queues, and intermediate compute state without external memory in some use cases.
- Extensive I/O in compact package: 704 user I/O in a 2397-BBGA surface-mount package supports dense board-level connectivity while maintaining a compact footprint.
- Industrial operating range: −40 °C to 100 °C rating and industrial grade designation support deployments in harsh or temperature-variable environments.
- Family-level performance and efficiency: Benefits from Stratix 10 GX family innovations (Hyperflex architecture, 14 nm FinFET) for improved core performance and power characteristics.
- Compliance and manufacturability: RoHS compliance and standard FCBGA packaging facilitate integration into production assemblies.
Why Choose 1SG165HU2F50I2VG?
The 1SG165HU2F50I2VG positions designers to tackle large, high-throughput FPGA designs that require extensive logic, substantial on-chip RAM, and broad I/O capability within a single device. Its industrial temperature rating and RoHS compliance make it suitable for systems intended for demanding operational environments.
Choosing this Stratix 10 GX device aligns with projects seeking scalable programmable fabric backed by the Stratix 10 family architecture—enabling complex protocol handling, throughput-optimized datapaths, and integrated acceleration while simplifying board-level design through high I/O density and a compact FCBGA package.
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