1SG165HU3F50E2VG

The 1SG165HU3F50E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) device built on the Stratix 10 GX family architecture. It combines the Hyperflex core architecture innovations and high-performance FPGA fabric with a large logic count and substantial on-chip RAM to address demanding bandwidth and compute tasks.

Designed for high-performance communications, compute acceleration and complex digital signal processing, this device offers a broad I/O complement, multi-hundred-megabit memory capacity and regulated low-voltage core operation for dense, power-sensitive system designs.

Key Features

• Core Architecture Intel Hyperflex core architecture and Stratix 10 GX family innovations deliver the architectural foundation for increased core performance as described in the device overview.
• Logic Capacity 1,650,000 logic elements for implementing large-scale digital designs and complex custom logic functions.
• On-chip Memory 119,537,664 total RAM bits to support large buffering, packet processing, and stateful algorithms directly in the FPGA fabric.
• I/O Density 704 I/O pins to support extensive peripheral interfacing, high-pin-count mezzanine connections or multi-lane high-speed links.
• Power and Voltage Core voltage supply range 770 mV to 970 mV allowing integration with low-voltage power rails typical of Stratix 10 family devices.
• Package and Mounting 2397-ball BGA (FCBGA) package; supplier package listed as 2397-FBGA, FC (50×50). Surface-mount mounting for high-density board integration.
• Operating Range and Grade Extended grade device with an operating temperature range of 0 °C to 100 °C suitable for many enterprise and datacenter environments.
• Standards and Compliance RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High‑speed networking and switching — Leverages the Stratix 10 GX family features for high-bandwidth transceiver and packet processing implementations using large logic and memory resources.
• Data center acceleration — Implements custom compute and compression or encryption pipelines using abundant DSP and logic resources and extensive on‑chip RAM.
• Telecommunications equipment — Supports backplane and multi‑lane interfaces with high I/O count and Stratix family transceiver capabilities described in the device overview.
• Advanced signal processing — Suited for complex DSP algorithms and multi-channel processing using the device’s large logic and memory capacity.

Unique Advantages

• Large programmable fabric: 1,650,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Significant on-chip memory: Nearly 120 Mbit of RAM supports deep buffering and stateful processing without external memory dependence.
• High I/O count: 704 I/Os allow flexible system partitioning and high-density interconnect for multi‑lane interfaces or extensive peripheral sets.
• Compact, high-density package: 2397-ball FCBGA package provides a space-efficient solution for server and network board designs.
• Controlled core voltage range: 770 mV–970 mV core supply supports tightly regulated power delivery for performance and efficiency management.
• Extended-grade thermal range: 0 °C–100 °C rating supports deployment in enterprise and datacenter operating environments.

Why Choose 1SG165HU3F50E2VG?

The 1SG165HU3F50E2VG positions itself as a high-capacity Stratix 10 GX FPGA option where large logic count, considerable on-chip RAM and extensive I/O are required. It is targeted at system designs that need to consolidate complex processing, high-throughput packet handling, or compute acceleration into a single programmable device while maintaining a controlled power envelope and compact package footprint.

For design teams seeking scalability and access to Stratix 10 family architectural features, this device provides a balance of performance-oriented architecture, sizable fabric resources and the package options needed for dense board implementations.

Request a quote or submit a procurement inquiry to evaluate 1SG165HU3F50E2VG for your next high-performance FPGA design.