1SG165HN3F43E3VG

The 1SG165HN3F43E3VG is an Intel Stratix® 10 GX field-programmable gate array in a 1760-BBGA FCBGA package. It leverages the Stratix 10 family architecture to deliver a high-density, high-performance FPGA platform suited for advanced, bandwidth- and compute-intensive applications.

This device combines a high logic element count with large on-chip RAM and extensive I/O to support designs in networking, data center acceleration, high-speed serial connectivity and compute-heavy signal processing while operating over a 0 °C to 100 °C range.

Key Features

• Core & Architecture  Intel Stratix 10 family architecture including the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process as described in the device overview.
• Logic Capacity  1,650,000 logic elements to implement large-scale digital designs and complex custom logic.
• On‑Chip Memory  119,537,664 total RAM bits for buffering, packet processing and local data storage.
• I/O and Package  688 user I/O pins in a surface-mount 1760-BBGA (FCBGA) package; supplier device package specified as 1760-FBGA (42.5 × 42.5 mm).
• High‑Speed Transceiver and Interfaces (Family Features)  Stratix 10 family transceiver and interface capabilities are documented in the device overview, including high-speed serial and hard IP blocks for common protocols.
• Supply Voltage  Core voltage range specified at 770 mV to 970 mV.
• Operating Range & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
• System and Configuration Features (Family)  Family-level features include device configuration, security options and power management technologies described in the Stratix 10 device overview.

Typical Applications

• High‑Performance Networking  Use in line cards, switches and routers where dense logic, large on-chip RAM and extensive I/O support packet processing and protocol offload.
• Data Center Acceleration  Suitable for FPGA-based acceleration tasks that require large logic capacity and memory for workload-specific kernels and data buffering.
• High‑Speed Serial Systems  Ideal for designs leveraging the Stratix 10 family’s high-speed transceiver capabilities for backplane, module or chip-to-chip links.
• Signal Processing and DSP  Applicable to compute-heavy signal processing tasks that benefit from large on-chip RAM and the family’s variable precision DSP resources.

Unique Advantages

• High Logic Density: 1,650,000 logic elements enable complex, multi-function designs without immediate need for multiple FPGAs.
• Large On‑Chip Memory: Nearly 120 million RAM bits provide significant local storage for buffering, look-up tables and state retention.
• Extensive I/O Connectivity: 688 I/O pins in a compact 1760-BBGA package simplify board-level interfacing to high-pin-count systems.
• Family-Level High‑Speed Capabilities: Stratix 10 family transceiver and hard-IP features support high-throughput serial and protocol implementations.
• Extended Grade: The device’s extended grade and 0 °C to 100 °C operating range fit many commercial and enterprise deployment environments.
• Compact Package Footprint: 1760-FBGA (42.5 × 42.5 mm) supplier package offers a balance of high pin count and manageable PCB area.

Why Choose 1SG165HN3F43E3VG?

1SG165HN3F43E3VG positions itself as a high-density Stratix 10 GX FPGA option for engineers building advanced systems that demand substantial logic resources, large on-chip RAM and broad I/O capability. Its family-level architectural innovations and documented features support designs that need scalable compute and high-speed connectivity.

This device is suited to development teams focused on networking, data acceleration, high-speed serial interconnects and DSP-centric applications who require an extended-grade, surface-mount FPGA in a 1760-BBGA package.

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