1SG165HN2F43I2VG

The 1SG165HN2F43I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package designed for demanding, high-performance applications. It combines 1,650,000 logic elements with 119,537,664 bits of on-chip RAM and 688 I/O to deliver substantial programmable capacity in a surface-mount package.

Built for advanced processing and bandwidth-centric applications, this device supports a wide operating range (770 mV to 970 mV core supply) and an industrial temperature rating (−40 °C to 100 °C), making it suitable for systems requiring high logic density, large memory resources, and extensive I/O connectivity.

Key Features

• Core Capacity  1,650,000 logic elements providing large-scale programmable fabric for complex logic, custom accelerators, and wide datapaths.
• On-Chip Memory  119,537,664 total RAM bits for embedded data buffering, lookup tables, and state storage.
• I/O Density  688 I/O pins to support broad external interfacing, parallel buses, and high-pin-count system connections.
• Package & Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-FBGA (42.5 × 42.5 mm). Surface-mount construction for standard board assembly.
• Power  Core voltage supply range of 770 mV to 970 mV, enabling integration into low-voltage, high-performance power domains.
• Thermal/Grade  Industrial grade with operating temperature from −40 °C to 100 °C for reliable operation in thermally demanding environments.
• Standards & Compliance  RoHS compliant for regulatory environmental requirements.
• Family Innovations (Series-Level)  Stratix 10 family features described in the datasheet include the Intel Hyperflex core architecture, Intel 14 nm tri-gate technology, and heterogeneous 3D SiP transceiver tiles—series capabilities that enable high core performance and advanced transceiver integration.

Typical Applications

• High‑performance networking and telecommunications  Use the device's large logic capacity and abundant I/O to implement packet processing, switching fabrics, and high-speed protocol engines.
• Data center acceleration  Deploy as a programmable accelerator for compute-intensive workloads that require large on-chip memory and dense logic resources.
• High-speed interface and backplane systems  Leverage the Stratix 10 family transceiver and fabric capabilities (series-level) for backplane links, multi‑lane physical interfaces, and protocol bridging.
• Advanced signal processing  Apply its large RAM and logic resources to DSP pipelines, fixed/floating point blocks, and custom processing chains.

Unique Advantages

• High logic density: 1,650,000 logic elements provide the programmable capacity needed for complex SoC-like designs without external ASIC development.
• Substantial on-chip RAM: 119,537,664 bits of embedded RAM reduce external memory dependency and improve data throughput for caching and buffering.
• Extensive I/O support: 688 I/O pins accommodate broad interfacing needs across peripherals, memory buses, and high-pin-count connectors.
• Industrial operating range: Rated from −40 °C to 100 °C for deployment in thermally challenging environments where industrial performance is required.
• Compact, serviceable package: 1760‑BBGA (42.5 × 42.5 mm) surface-mount package balances high pin count with PCB footprint considerations for dense system boards.
• Low-voltage core operation: 770 mV to 970 mV supply range supports integration into modern low-voltage power architectures.

Why Choose 1SG165HN2F43I2VG?

The 1SG165HN2F43I2VG positions itself as a high-capacity FPGA choice for customers designing bandwidth- and compute-intensive systems. With 1.65 million logic elements, over 119 million bits of on-chip RAM, and 688 I/Os in an industrial-temperature, surface-mount BBGA package, it delivers the core resources required to implement complex, high-throughput hardware functions within a programmable platform.

This Stratix 10 GX device is suited to teams that need scalable programmable logic, substantial embedded memory, and high I/O density in a single component—enabling consolidation of functions, shortened development cycles, and design flexibility across advanced communication, data center, and signal-processing products.

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