1SG110HN3F43I2LG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1100000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 929 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 137500 | Number of Logic Elements/Cells | 1100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 112197632 |
Overview of 1SG110HN3F43I2LG – Stratix® 10 GX FPGA, 688 I/O, 1,100,000 logic elements, 1760-BBGA
The 1SG110HN3F43I2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a high-pin-count 1760-BBGA (FCBGA) package. It delivers a large programmable fabric—1,100,000 logic elements—with extensive on-chip RAM and I/O to address high-bandwidth, compute‑intensive designs in industrial and communications systems.
Built on the Stratix 10 family architecture, the device is intended for applications requiring high processing density, large on-chip memory, and a broad I/O set, while supporting industrial temperature operation and RoHS compliance.
Key Features
- Programmable Capacity — 1,100,000 logic elements provide substantial resources for complex logic, custom accelerators, and large FPGA designs.
- On-Chip Memory — 112,197,632 total RAM bits for buffering, packet processing, and data staging directly in the FPGA fabric.
- High-Density I/O — 688 user I/O pins to support wide parallel interfaces, multi-lane serial links, or abundant peripheral connectivity.
- Packaging and Mounting — Supplied in a 1760-BBGA (FCBGA) package; supplier device package is 1760-FBGA (42.5×42.5 mm) and designed for surface-mount assembly.
- Industrial Temperature Range — Qualified for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
- Low-Voltage Core — Specified core supply range of 820 mV to 880 mV for integration with modern power domains and power-optimized system designs.
- RoHS Compliant — Meets RoHS environmental requirements for lead‑free assembly.
- Stratix 10 Family Innovations (series-level) — The Stratix 10 family incorporates the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) manufacturing technology to enable high-performance, high-efficiency FPGA designs.
- Advanced Series-Level IP — Series-level features include high-speed transceiver support, hard PCIe Gen3 IP and DSP capabilities, and a range of PLL and memory controller options (refer to the Stratix 10 family documentation for full details).
Typical Applications
- High‑Performance Networking — Use the device’s large logic capacity and abundant I/O for packet processing, switch fabrics, and line-rate protocol handling.
- Data Center & Accelerator Platforms — Implement custom data-path accelerators, packet brokers, or offload engines that require extensive on-chip RAM and logic resources.
- Telecommunications Infrastructure — Support multi-channel, high-throughput transceivers and protocol processing in base station, transport, and backhaul equipment.
- Industrial Systems — Deploy in industrial control, imaging, and test equipment where a wide operating temperature range and high pin-count I/O are required.
Unique Advantages
- Large Programmable Fabric: 1,100,000 logic elements enable complex system integration and consolidation of multiple functions onto a single device.
- Significant On‑Chip Memory: 112,197,632 bits of RAM reduce dependence on external memory for intermediate buffering and enable higher throughput.
- Extensive I/O Count: 688 I/O pins provide flexibility to interface directly with wide parallel buses, multiple high-speed lanes, and numerous peripherals.
- Industrial Reliability: −40 °C to 100 °C operating range and surface-mount 1760-BBGA packaging support deployment in harsh or tightly packaged systems.
- Power-Optimized Core: Narrow core voltage window (820–880 mV) facilitates optimized power delivery for energy-sensitive designs.
- Proven Family-Level Architecture: Benefits from Stratix 10 family innovations such as the Hyperflex core architecture and 14 nm FinFET technology for higher performance and efficiency.
Why Choose 1SG110HN3F43I2LG?
This Stratix 10 GX FPGA part combines very large logic capacity, substantial on‑chip memory, and a high I/O count in a single surface-mount 1760-BBGA package, making it well suited for engineers consolidating complex functions into one device. Its industrial temperature rating and RoHS compliance support deployment in demanding environments while maintaining environmental compliance.
Design teams targeting high-bandwidth networking, data center acceleration, telecommunications infrastructure, or advanced industrial systems will find the 1SG110HN3F43I2LG offers the programmable resources and platform-level features needed for scalable, performance-focused designs within the Stratix 10 family.
Request a quote or submit an inquiry for pricing and availability to move your design forward with this high-capacity Stratix 10 GX FPGA.

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