1SG110HN3F43E3VG

The 1SG110HN3F43E3VG is a Stratix® 10 GX field programmable gate array (FPGA) IC designed for high‑performance, large‑scale programmable logic applications. It is built on the Stratix 10 GX family architecture described in the device overview, which includes the Intel Hyperflex core architecture and Intel 14 nm tri‑gate technology.

This device provides a large logic fabric, extensive on‑chip memory, and a broad I/O count for demanding communications, compute acceleration, and advanced signal processing applications where integration and predictable electrical characteristics matter.

Key Features

• Core Logic  1,100,000 logic elements provide extensive programmable resources for complex logic, control, and computation tasks.
• Adaptive Logic Modules  137,500 ALM/CLB units are reported for the device architecture, enabling fine‑grained logic packing and routing.
• On‑Chip Memory  112,197,632 total RAM bits support large buffering, state machines, and embedded data structures without immediate external memory dependence.
• I/O Capacity  688 general‑purpose I/O pins accommodate high‑density external interfacing for multi‑lane links, control buses, and parallel I/O systems.
• Power Supply  Core supply operating range 770 mV to 970 mV, allowing designers to align power delivery and sequencing to system budgets.
• Temperature and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for use in controlled ambient environments and industrial applications within this range.
• Package  1760‑BBGA FCBGA package (1760‑FBGA, 42.5 × 42.5 mm) provides a high‑pin‑count, compact form factor for board‑level integration.
• Family Innovations (Stratix 10 GX)  Device overview cites Intel Hyperflex core architecture and family features such as heterogeneous 3D SiP transceiver tiles, fractional synthesis PLLs, and high‑performance DSP and memory subsystem technologies.

Typical Applications

• High‑Performance Networking: Implement multi‑lane backplane and chassis interfaces leveraging the device’s high I/O count and large logic capacity for packet processing and traffic management.
• Data Center Acceleration: Use the extensive logic and on‑chip RAM to implement compute accelerators, protocol offload engines, and low‑latency datapaths.
• Telecommunications Equipment: Deploy for aggregation, switching, and protocol adaptation functions where dense I/O and large programmable fabric are required.
• Advanced Signal Processing: Implement large FPGA‑based signal chains, buffering, and control logic for applications requiring substantial on‑chip memory and logic resources.

Unique Advantages

• Large Programmable Fabric: 1,100,000 logic elements enable implementation of complex systems on a single device, reducing the need for multi‑FPGA partitioning.
• Substantial Embedded Memory: Over 112 million bits of on‑chip RAM reduce dependence on external memory for buffering and stateful processing, simplifying board design.
• High I/O Density: 688 I/O pins support rich external interfacing for multi‑lane communications, sensor arrays, and wide parallel buses.
• Compact High‑Pin Package: 1760‑BBGA FCBGA package concentrates large I/O and logic capacity in a manageable PCB footprint for high‑density systems.
• Controlled Operating Envelope: Extended grade with 0 °C to 100 °C operating range and defined core voltage range supports predictable thermal and power planning.
• Family‑Level Architecture: Support from the Stratix 10 GX device family innovations (Hyperflex core architecture, advanced PLLs, DSP blocks) helps in leveraging established architectural capabilities.

Why Choose 1SG110HN3F43E3VG?

The 1SG110HN3F43E3VG positions itself for designs that require very large programmable logic capacity combined with substantial on‑chip memory and a high I/O count in a compact BGA package. Its Stratix 10 GX family architecture elements provide a foundation for high‑throughput, low‑latency designs where integration and reproducible electrical parameters are important.

This device is well suited to system engineers building complex networking, data center, telecommunications, or signal processing solutions who need to consolidate logic and memory into a single device while maintaining a controlled operating voltage and temperature envelope.

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