1SG110HN3F43E2VGS1

The 1SG110HN3F43E2VGS1 is a Stratix® 10 GX field programmable gate array (FPGA) packaged in a 1760‑BBGA (FCBGA) surface‑mount case. As a member of the Stratix 10 GX family, it combines a high‑density programmable fabric with the family’s Hyperflex core architecture and advanced silicon process to address demanding, high‑performance and high‑bandwidth system designs.

Targeted at applications that require large logic capacity, extensive on‑chip memory and dense I/O, this device delivers a combination of integration and power‑aware operation suitable for advanced communications, data center acceleration and high‑throughput signal processing systems.

Key Features

• Core & Logic 1,100,000 logic elements provide large programmable capacity for complex custom logic and compute kernels within the Stratix 10 GX family architecture.
• On‑chip Memory 112,197,632 total RAM bits of on‑chip memory for buffering, look‑up tables and algorithmic storage.
• I/O Density 688 user I/Os support dense external interfacing for high‑pin‑count systems and complex board routing.
• Power Supply Range Core voltage range from 770 mV to 970 mV enabling operation within Stratix 10 power domains.
• Package & Mounting 1760‑BBGA (supplier package: 1760‑FBGA, 42.5 × 42.5 mm) in a surface‑mount form factor for high‑density PCB integration.
• Temperature & Grade Extended grade with an operating temperature range of 0 °C to 100 °C suitable for many commercial and enterprise environments.
• Standards & Compliance RoHS compliant for environmental and manufacturing compliance.
• Stratix 10 GX Family Innovations Family features include the Intel Hyperflex core architecture, 14 nm tri‑gate process innovations, high‑speed transceiver and hard IP options (as described in the Stratix 10 GX device overview).

Typical Applications

• High‑Performance Networking Programmable packet processing, switching and protocol acceleration where dense logic and extensive I/O enable custom datapath implementations.
• Data Center Acceleration Offload and acceleration tasks that benefit from large on‑chip RAM and programmable compute fabric for custom algorithms and dataflow pipelines.
• High‑Speed Communications Backplane and optical interface systems that require dense I/O and programmable transceiver integration available within the Stratix 10 GX family.
• Signal Processing & DSP Compute‑intensive signal processing workloads that leverage high logic capacity and on‑chip memory for buffering and algorithm deployment.

Unique Advantages

• Large Programmable Capacity: 1,100,000 logic elements provide headroom for complex, tightly integrated custom logic and system functions.
• Substantial On‑Chip Memory: Over 112 million bits of RAM reduce external memory dependence and simplify buffering and lookup implementations.
• High I/O Count: 688 I/Os enable extensive peripheral, interface and mezzanine connectivity without excessive board‑level multiplexing.
• High‑density Packaging: 1760‑BBGA in a 42.5 × 42.5 mm footprint supports high pin count and compact PCB designs for advanced systems.
• Family‑Level Performance Features: Benefits from Stratix 10 GX family innovations—such as the Hyperflex core architecture and advanced process technology—delivering improved core performance and power characteristics described in the device overview.
• Regulatory & Manufacturing Readiness: RoHS compliance and surface‑mount packaging facilitate integration into modern assembly flows.

Why Choose 1SG110HN3F43E2VGS1?

The 1SG110HN3F43E2VGS1 is positioned for system designs that require a high number of logic elements, extensive on‑chip memory and dense I/O in a single FPGA package. Its Stratix 10 GX family heritage brings architectural and process innovations that support demanding bandwidth and compute requirements while allowing designers to consolidate functionality within the programmable fabric.

This device is well suited for engineers and teams building high‑performance networking, data center, communications and signal processing equipment who need a scalable, high‑capacity FPGA with enterprise‑grade packaging and compliance for production use.

Request a quote or submit a purchase inquiry to evaluate 1SG110HN3F43E2VGS1 for your next high‑performance FPGA design.