1SG110HN2F43I1VG

The 1SG110HN2F43I1VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760-BBGA (FCBGA) package. It leverages the Stratix 10 family architecture to deliver high logic capacity, large on-chip memory, and a wide complement of I/O for demanding, high-performance applications.

Designed for industrial-grade applications, this device targets advanced designs that require high logic density, extensive RAM resources and high I/O counts while operating across a broad temperature range and low-voltage core supply.

Key Features

• Core Architecture  Intel Stratix 10 family architecture including the Intel Hyperflex core innovations described for the Stratix 10 GX family.
• Logic Capacity  1,100,000 logic elements (LEs) suitable for large, complex FPGA designs.
• Embedded Memory  112,197,632 total RAM bits providing substantial on-chip storage for buffering, FIFOs and on-chip data structures.
• I/O and Connectivity  688 I/O pins to support extensive peripheral interfaces and high-channel count systems.
• Package and Mounting  1760-BBGA (1760-FBGA, 42.5 × 42.5) surface-mount package for high-density board integration.
• Power  Core voltage supply range from 770 mV to 970 mV to match modern low-voltage FPGA power domains.
• Operating Range  Industrial operating temperature from −40 °C to 100 °C for deployments in demanding environments.
• Compliance  RoHS compliant.
• Family-Level Capabilities  Stratix 10 GX family features documented in the device overview include Intel 14 nm FinFET technology, high-performance Hyperflex core architecture, and family-level hard IP such as PCIe and 10G Ethernet (as described in the Stratix 10 GX/SX device overview).

Typical Applications

• High-speed Communications  Use for networking and transceiver-rich systems where high I/O counts and family-level transceiver capabilities support high-bandwidth links.
• Data Acceleration and Compute  Suitable for acceleration tasks that require large logic capacity and substantial on-chip RAM for buffering and processing.
• Signal Processing  Ideal for advanced digital signal processing pipelines that need dense logic, extensive memory and reliable thermal and power characteristics.

Unique Advantages

• High Logic Density:  1,100,000 logic elements let you implement large, complex designs on a single device, reducing board-level complexity.
• Large On-Chip Memory:  112,197,632 RAM bits provide ample internal storage for data-intensive processing without relying solely on external memory.
• Extensive I/O:  688 I/Os accommodate high channel counts and diverse interfacing requirements, simplifying system integration.
• Industrial Temperature Rating:  −40 °C to 100 °C operation supports deployment in thermally challenging and industrial environments.
• Compact, High-Density Package:  1760-BBGA (42.5 × 42.5 mm) enables a high-pin-count implementation in a compact footprint for modern PCB layouts.
• Low-Voltage Core Support:  770 mV–970 mV core supply aligns with contemporary low-voltage power architectures.

Why Choose 1SG110HN2F43I1VG?

The 1SG110HN2F43I1VG combines the Stratix 10 GX family architecture with high logic capacity, large embedded RAM and a wide I/O complement to address advanced, high-performance designs. Its industrial temperature rating and surface-mount 1760-BBGA package make it suitable for demanding applications that require reliability and density.

This device is well suited to engineering teams developing complex FPGA-based systems that need significant on-chip resources, scalable performance and compatibility with the Stratix 10 family features documented in the device overview. Its RoHS compliance and defined electrical and thermal ranges support long-term deployment considerations and procurement planning.

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